Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74LV164BQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LV164BQ-Q100SOT762-1DHVQFN1418.52357 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9353025471156126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000231.000000.00126
FillerSilver (Ag)7440-22-40.0174475.000000.09418
PolymerAcrylic resinProprietary0.001406.000000.00753
Resin systemProprietary0.0041918.000000.02260
subTotal0.02326100.000000.12557
DieDoped siliconSilicon (Si)7440-21-30.55472100.000002.99465
subTotal0.55472100.000002.99465
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.7447197.4700036.41150
Iron (Fe)7439-89-60.166072.400000.89656
Phosphorus (P)7723-14-00.002080.030000.01121
Zinc (Zn)7440-66-60.006920.100000.03736
subTotal6.91978100.0000037.35663
Mould CompoundAdditiveNon hazardousProprietary0.313922.984001.69469
FillerSilica -amorphous-7631-86-90.367153.490001.98206
Silica fused60676-86-08.9230784.8200048.17145
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.105411.002000.56906
PigmentCarbon black1333-86-40.017250.164000.09314
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.389353.701002.10189
Epoxy resin systemProprietary0.166851.586000.90073
Phenolic resinProprietary0.237022.253001.27954
subTotal10.52001100.0000056.79256
Pre-PlatingPure metal layerGold (Au)7440-57-50.013843.000000.07473
Nickel (Ni)7440-02-00.4258792.300002.29908
Palladium (Pd)7440-05-30.014303.100000.07722
Silver (Ag)7440-22-40.007381.600000.03985
subTotal0.46140100.000002.49088
WirePure metalCopper (Cu)7440-50-80.0428896.550000.23147
Pure metal layerGold (Au)7440-57-50.000160.350000.00084
Palladium (Pd)7440-05-30.001383.100000.00743
subTotal0.04441100.000000.23974
total18.52357100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.