Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BAS16TH

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BAS16THSOT23TO-236AB7.70039 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346603182152126030 s123520 s3
9346603182352126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.03000100.000000.38959
subTotal0.03000100.000000.38959
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.002290.090000.02979
Carbon (C)7440-44-00.001020.040000.01324
Chromium (Cr)7440-47-30.005610.220000.07282
Cobalt (Co)7440-48-40.010960.430000.14234
Iron (Fe)7439-89-61.2230147.9800015.88244
Manganese (Mn)7439-96-50.021920.860000.28468
Nickel (Ni)7440-02-00.9212136.1400011.96314
Phosphorus (P)7723-14-00.000510.020000.00662
Silicon (Si)7440-21-30.006630.260000.08607
Sulphur (S)7704-34-90.000510.020000.00662
Pure metal layerCopper (Cu)7440-50-80.2898211.370003.76372
Silver (Ag)7440-22-40.065512.570000.85073
subTotal2.54900100.0000033.10221
Mould CompoundFillerSilica fused60676-86-03.7046875.1000048.11033
PigmentCarbon black1333-86-40.014800.300000.19219
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.8632817.5000011.21080
Phenol Formaldehyde resin (generic)9003-35-40.350247.100004.54838
subTotal4.93300100.0000064.06170
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00011
Non hazardousProprietary0.000100.055500.00133
Tin solderTin (Sn)7440-31-50.1848999.940002.40103
subTotal0.18500100.000002.40247
WirePure metalCopper (Cu)7440-50-80.00339100.000000.04402
subTotal0.00339100.000000.04402
total7.70039100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.