Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content LSF0108BQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
LSF0108BQSOT764-1DHVQFN2028.05567 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9356902881155126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000851.000000.00304
FillerSilver (Ag)7440-22-40.0639675.000000.22798
PolymerAcrylic resinProprietary0.005126.000000.01824
Resin systemProprietary0.0153518.000000.05471
subTotal0.08528100.000000.30397
DieDoped siliconSilicon (Si)7440-21-30.36948100.000001.31696
subTotal0.36948100.000001.31696
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.5891697.4700037.74339
Iron (Fe)7439-89-60.260742.400000.92935
Phosphorus (P)7723-14-00.003260.030000.01162
Zinc (Zn)7440-66-60.010860.100000.03872
subTotal10.86402100.0000038.72308
Mould CompoundAdditiveNon hazardousProprietary0.488632.984001.74163
FillerSilica -amorphous-7631-86-90.571483.490002.03697
Silica fused60676-86-013.8892084.8200049.50585
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.164081.002000.58483
PigmentCarbon black1333-86-40.026850.164000.09572
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.606043.701002.16012
Epoxy resin systemProprietary0.259711.586000.92568
Phenolic resinProprietary0.368932.253001.31498
subTotal16.37491100.0000058.36578
Pre-PlatingPure metal layerGold (Au)7440-57-50.002761.000000.00983
Nickel (Ni)7440-02-00.2509591.000000.89447
Palladium (Pd)7440-05-30.022068.000000.07864
subTotal0.27577100.000000.98294
WirePure metalCopper (Cu)7440-50-80.0832396.550000.29667
Pure metal layerGold (Au)7440-57-50.000300.350000.00108
Palladium (Pd)7440-05-30.002673.100000.00953
subTotal0.08621100.000000.30728
total28.05567100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.