Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content NSF040120D7A0

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
NSF040120D7A0SOT8070-1TO263-7L1503.90175 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346673901183126030 s123520 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped silicon carbideSilicon Carbide (SiC)409-21-21.72700100.000000.11483
subTotal1.72700100.000000.11483
Lead FrameCopper alloyCopper (Cu)7440-50-8859.7851399.8589057.17030
Iron (Fe)7439-89-60.706880.082100.04700
Phosphorus (P)7723-14-00.223860.026000.01489
Nickel alloyNickel (Ni)7440-02-00.086100.010000.00573
Phosphorus (P)7723-14-00.120540.014000.00802
Pure metal layerNickel (Ni)7440-02-00.077490.009000.00515
subTotal861.00000100.0000057.25109
Mould CompoundFillerSilica -amorphous-7631-86-992.1885015.000006.12995
Silica fused60676-86-0460.9425075.0000030.64977
PigmentCarbon black1333-86-43.072950.500000.20433
PolymerEpoxy resin systemProprietary46.094257.500003.06498
Phenolic resinProprietary12.291802.000000.81733
subTotal614.59000100.0000040.86636
Post-PlatingImpurityNon hazardousProprietary0.001430.010000.00010
Tin solderTin (Sn)7440-31-514.2985799.990000.95076
subTotal14.30000100.000000.95086
Solder WireLead alloyLead (Pb)7439-92-15.3295093.500000.35438
Silver (Ag)7440-22-40.085501.500000.00569
Tin (Sn)7440-31-50.285005.000000.01895
subTotal5.70000100.000000.37902
WireImpurityCopper (Cu)7440-50-80.000000.001000.00000
Iron (Fe)7439-89-60.000000.001000.00000
Magnesium (Mg)7439-95-40.000000.001000.00000
Nickel (Ni)7440-02-00.000020.006000.00000
Silicon (Si)7440-21-30.000000.001000.00000
Pure metalAluminium (Al)7429-90-50.2941599.990000.01956
subTotal0.29418100.000000.01956
WireImpurityCopper (Cu)7440-50-80.000060.001000.00000
Iron (Fe)7439-89-60.000060.001000.00000
Magnesium (Mg)7439-95-40.000060.001000.00000
Nickel (Ni)7440-02-00.000380.006000.00003
Silicon (Si)7440-21-30.000060.001000.00000
Pure metalAluminium (Al)7429-90-56.2899499.990000.41824
subTotal6.29057100.000000.41827
total1503.90175100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.