Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PSMN1R0-30YLD

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PSMN1R0-30YLDSOT669LFPAK85.61000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340682341154126030 s126020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-34.50000100.000005.25640
subTotal4.50000100.000005.25640
ClipCopper alloyCopper (Cu)7440-50-84.9933899.867625.83271
Iron (Fe)7439-89-60.005000.099910.00584
Phosphorus (P)7723-14-00.001620.032470.00190
subTotal5.00000100.000005.84045
Lead FrameCopper alloyCopper (Cu)7440-50-837.8379799.8100044.19807
Iron (Fe)7439-89-60.056860.150000.06642
Phosphorus (P)7723-14-00.015160.040000.01771
subTotal37.91000100.0000044.28220
Mould CompoundFillerSilica fused60676-86-013.7433061.0000016.05338
Flame retardantZinc Borate138265-88-02.2530010.000002.63170
PigmentCarbon black1333-86-40.067590.300000.07895
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-24.4384119.700005.18445
Phenolic resinProprietary2.027709.000002.36853
subTotal22.53000100.0000026.31701
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00045
Tin alloyTin (Sn)7440-31-53.8496299.990004.49669
subTotal3.85000100.000004.49714
Solder PasteLead alloyLead (Pb)7439-92-13.2837592.500003.83571
Silver (Ag)7440-22-40.088752.500000.10367
Tin (Sn)7440-31-50.177505.000000.20734
subTotal3.55000100.000004.14672
Solder PasteImpurityAntimony (Sb)7440-36-00.002480.030000.00290
Lead alloyLead (Pb)7439-92-17.6472792.470008.93268
Silver (Ag)7440-22-40.206752.500000.24150
Tin (Sn)7440-31-50.413505.000000.48300
subTotal8.27000100.000009.66008
total85.61000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.