Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PSMN2R2-30YLC

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PSMN2R2-30YLCSOT669LFPAK78.13000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340651911156126030 s126020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-32.30000100.000002.94381
subTotal2.30000100.000002.94381
ClipCopper alloyCopper (Cu)7440-50-84.9933899.867626.39112
Iron (Fe)7439-89-60.005000.099910.00639
Phosphorus (P)7723-14-00.001620.032470.00208
subTotal5.00000100.000006.39959
Lead FrameCopper alloyCopper (Cu)7440-50-837.8379799.8100048.42950
Iron (Fe)7439-89-60.056860.150000.07278
Phosphorus (P)7723-14-00.015160.040000.01941
subTotal37.91000100.0000048.52169
Mould CompoundFillerSilica fused60676-86-013.7433061.0000017.59030
Flame retardantZinc Borate138265-88-02.2530010.000002.88366
PigmentCarbon black1333-86-40.067590.300000.08651
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-24.4384119.700005.68080
Phenolic resinProprietary2.027709.000002.59529
subTotal22.53000100.0000028.83656
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00049
Tin alloyTin (Sn)7440-31-53.8496299.990004.92719
subTotal3.85000100.000004.92768
Solder PasteLead alloyLead (Pb)7439-92-16.0495092.500007.74286
Silver (Ag)7440-22-40.163502.500000.20927
Tin (Sn)7440-31-50.327005.000000.41853
subTotal6.54000100.000008.37066
total78.13000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.