Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PSMN7R5-30YLD

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PSMN7R5-30YLDSOT669LFPAK88.30000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340679671153126030 s126020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.62000100.000000.70215
subTotal0.62000100.000000.70215
ClipCopper alloyCopper (Cu)7440-50-819.9740099.8700022.62061
Iron (Fe)7439-89-60.020000.100000.02265
Phosphorus (P)7723-14-00.006000.030000.00680
subTotal20.00000100.0000022.65006
Lead FrameCopper alloyCopper (Cu)7440-50-837.8379799.8100042.85161
Iron (Fe)7439-89-60.056860.150000.06440
Phosphorus (P)7723-14-00.015160.040000.01717
subTotal37.91000100.0000042.93318
Mould CompoundFillerSilica fused60676-86-013.7433061.0000015.56433
Flame retardantZinc Borate138265-88-02.2530010.000002.55153
PigmentCarbon black1333-86-40.067590.300000.07655
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-24.4384119.700005.02651
Phenolic resinProprietary2.027709.000002.29638
subTotal22.53000100.0000025.51530
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00044
Tin alloyTin (Sn)7440-31-53.8496299.990004.35970
subTotal3.85000100.000004.36014
Solder PasteLead alloyLead (Pb)7439-92-13.1357592.500003.55125
Silver (Ag)7440-22-40.084752.500000.09598
Tin (Sn)7440-31-50.169505.000000.19196
subTotal3.39000100.000003.83919
total88.30000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.