Features and benefits
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Wide supply voltage range from 0.8 V to 3.6 V
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CMOS low power dissipation
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High noise immunity
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Overvoltage tolerant inputs to 3.6 V
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Low noise overshoot and undershoot < 10 % of VCC
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IOFF circuitry provides partial Power-down mode operation
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Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
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Low static-power consumption; ICC = 0.9 μA (maximum)
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Complies with JEDEC standards:
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JESD8-12 (0.8 V to 1.3 V)
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JESD8-11 (0.9 V to 1.65 V)
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JESD8-7 (1.65 V to 1.95 V)
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JESD8-5 (2.3 V to 2.7 V)
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JESD8C (2.7 V to 3.6 V)
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ESD protection:
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HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V
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CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
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Multiple package options
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Specified from -40 °C to +85 °C and -40 °C to +125 °C
Parametrics
Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|
74AUP2G07GM | Production | 0.8 - 3.6 | CMOS | 1.9 | 70 | 2 | ultra low | -40~125 | 290 | 145 | XSON6 |
74AUP2G07GN | Production | 0.8 - 3.6 | CMOS | 1.9 | 70 | 2 | ultra low | -40~125 | 275 | 171 | XSON6 |
74AUP2G07GS | Production | 0.8 - 3.6 | CMOS | 1.9 | 70 | 2 | ultra low | -40~125 | 272 | 177 | XSON6 |
74AUP2G07GW | Production | 0.8 - 3.6 | CMOS | 1.9 | 70 | 2 | ultra low | -40~125 | 264 | 153 | TSSOP6 |
74AUP2G07GX | Production | 0.8 - 3.6 | CMOS | 1.9 | 70 | 2 | ultra low | -40~125 | - | - | X2SON6 |
Package
Type number | Package | Package information | Reflow-/Wave soldering | Packing | Status | Marking | Orderable part number, (Ordering code (12NC)) |
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74AUP2G07GM | XSON6 (SOT886) | SOT886 | REFLOW_BG-BD-1 | SOT886_132 | Active | p7 | 74AUP2G07GM,132 ( 9352 799 86132 ) |
SOT886_115 | Active | p7 | 74AUP2G07GM,115 ( 9352 799 86115 ) | ||||
74AUP2G07GN | XSON6 (SOT1115) | SOT1115 | REFLOW_BG-BD-1 | SOT1115_132 | Active | p7 | 74AUP2G07GN,132 ( 9352 917 61132 ) |
74AUP2G07GS | XSON6 (SOT1202) | SOT1202 | REFLOW_BG-BD-1 | SOT1202_132 | Active | p7 | 74AUP2G07GS,132 ( 9352 928 86132 ) |
74AUP2G07GW | TSSOP6 (SOT363-2) | SOT363-2 | SOT363-2_125 | Active | p7 | 74AUP2G07GW,125 ( 9352 799 85125 ) | |
74AUP2G07GX | X2SON6 (SOT1255) | SOT1255 | REFLOW_BG-BD-1 | SOT1255_147 | Active | p7 | 74AUP2G07GXZ ( 9353 070 96147 ) |
Discontinuation information
Type number | Orderable part number, (Ordering code (12NC)) | Last time buy date | Last time delivery date | Replacement product | Status | Comments |
---|---|---|---|---|---|---|
74AUP2G07GX | 935307096125 |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator | Leadfree conversion date |
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74AUP2G07GM | 74AUP2G07GM,132 | 74AUP2G07GM | Always Pb-free | ||
74AUP2G07GM | 74AUP2G07GM,115 | 74AUP2G07GM | Always Pb-free | ||
74AUP2G07GN | 74AUP2G07GN,132 | 74AUP2G07GN | Always Pb-free | ||
74AUP2G07GS | 74AUP2G07GS,132 | 74AUP2G07GS | Always Pb-free | ||
74AUP2G07GW | 74AUP2G07GW,125 | 74AUP2G07GW | Always Pb-free | ||
74AUP2G07GX | 74AUP2G07GXZ | 74AUP2G07GX | Always Pb-free |
Documentation (19)
File name | Title | Type | Date |
---|---|---|---|
74AUP2G07 | Low-power dual buffer with open-drain output | Data sheet | 2023-07-26 |
AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
AN11052 | Pin FMEA for AUP family | Application note | 2019-01-09 |
aup2g07 | aup2g07 IBIS model | IBIS model | 2015-09-06 |
Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Leaflet | 2019-04-12 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
SOT1255 | plastic, leadless thermal enhanced extremely thin small outline package; 6 terminals; 0.4 mm pitch; 1 mm x 0.8 mm x 0.35 mm body | Package information | 2022-05-31 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT1115 | MAR_SOT1115 Topmark | Top marking | 2013-06-03 |
SOT1115 | plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Package information | 2022-05-27 |
MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
Support
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Models
File name | Title | Type | Date |
---|---|---|---|
aup2g07 | aup2g07 IBIS model | IBIS model | 2015-09-06 |
Ordering, pricing & availability
Sample
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