Features and benefits
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Wide supply voltage range from 0.8 V to 3.6 V
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High noise immunity
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Complies with JEDEC standards:
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JESD8-12 (0.8 V to 1.3 V)
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JESD8-11 (0.9 V to 1.65 V)
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JESD8-7 (1.2 V to 1.95 V)
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JESD8-5 (1.8 V to 2.7 V)
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JESD8-B (2.7 V to 3.6 V)
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Low static power consumption; ICC = 0.9 μA (maximum)
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Latch-up performance exceeds 100 mA per JESD 78 Class II
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Inputs accept voltages up to 3.6 V
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Low noise overshoot and undershoot < 10 % of VCC
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IOFF circuitry provides partial Power-down mode operation
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ESD protection:
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HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V
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CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
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Specified from -40 °C to +85 °C and -40 °C to +125 °C
Parametrics
Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|
74AUP2G16GM | Production | 0.8 - 3.6 | CMOS | ± 1.9 | 70 | 2 | ultra low | -40~125 | 290 | 145 | XSON6 |
74AUP2G16GW | Production | 0.8 - 3.6 | CMOS | ± 1.9 | 70 | 2 | ultra low | -40~125 | 264 | 153 | TSSOP6 |
Package
Type number | Package | Package information | Reflow-/Wave soldering | Packing | Status | Marking | Orderable part number, (Ordering code (12NC)) |
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74AUP2G16GM | XSON6 (SOT886) | SOT886 | REFLOW_BG-BD-1 | SOT886_125 | Active | 5A | 74AUP2G16GMH ( 9353 075 48125 ) |
74AUP2G16GW | TSSOP6 (SOT363-2) | SOT363-2 | SOT363-2_125 | Active | 5A | 74AUP2G16GWH ( 9353 075 47125 ) |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator | Leadfree conversion date |
---|---|---|---|---|---|
74AUP2G16GM | 74AUP2G16GMH | 74AUP2G16GM | Always Pb-free | ||
74AUP2G16GW | 74AUP2G16GWH | 74AUP2G16GW | Always Pb-free |
Documentation (8)
File name | Title | Type | Date |
---|---|---|---|
74AUP2G16 | Low-power dual buffer | Data sheet | 2023-07-26 |
aup2g16 | 74AUP2G16 IBIS model | IBIS model | 2015-10-29 |
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Leaflet | 2019-04-12 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
Support
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Models
File name | Title | Type | Date |
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aup2g16 | 74AUP2G16 IBIS model | IBIS model | 2015-10-29 |
Ordering, pricing & availability
Sample
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If you do not have a direct account with Nexperia our network of global and regional distributors is available and equipped to support you with Nexperia samples. Check out the list of official distributors.