Features and benefits
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Wide supply voltage range from 0.8 V to 3.6 V
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CMOS low power dissipation
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High noise immunity
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Low static power consumption; ICC = 0.9 μA (maximum)
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Latch-up performance exceeds 100 mA per JESD 78 Class II
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Overvoltage tolerant inputs to 3.6 V
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Low noise overshoot and undershoot < 10 % of VCC
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IOFF circuitry provides partial power-down mode operation
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Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
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ESD protection:
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HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V
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CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
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Multiple package options
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Specified from -40 °C to +85 °C and -40 °C to +125 °C
Parametrics
Type number | Product status | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
74AUP1G58GM | Production | n.a. | n.a. | CMOS | ± 1.9 | 8.7 | 70 | 1 | ultra low | -40~125 | 290 | 6.5 | 145 | XSON6 |
74AUP1G58GN | Production | n.a. | n.a. | CMOS | ± 1.9 | 8.7 | 70 | 1 | ultra low | -40~125 | 275 | 11.7 | 171 | XSON6 |
74AUP1G58GS | Production | n.a. | n.a. | CMOS | ± 1.9 | 8.7 | 70 | 1 | ultra low | -40~125 | 272 | 14.8 | 177 | XSON6 |
74AUP1G58GW | Production | n.a. | n.a. | CMOS | ± 1.9 | 8.7 | 70 | 1 | ultra low | -40~125 | 264 | 38.6 | 153 | TSSOP6 |
74AUP1G58GX | Production | n.a. | n.a. | CMOS | ± 1.9 | 8.7 | 70 | 1 | ultra low | -40~125 | - | - | - | X2SON6 |
Package
Type number | Package | Package information | Reflow-/Wave soldering | Packing | Status | Marking | Orderable part number, (Ordering code (12NC)) |
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74AUP1G58GM | XSON6 (SOT886) | SOT886 | REFLOW_BG-BD-1 | SOT886_132 | Active | aK | 74AUP1G58GM,132 ( 9352 799 61132 ) |
SOT886_115 | Active | aK | 74AUP1G58GM,115 ( 9352 799 61115 ) | ||||
74AUP1G58GN | XSON6 (SOT1115) | SOT1115 | REFLOW_BG-BD-1 | SOT1115_132 | Active | aK | 74AUP1G58GN,132 ( 9352 917 44132 ) |
74AUP1G58GS | XSON6 (SOT1202) | SOT1202 | REFLOW_BG-BD-1 | SOT1202_132 | Active | aK | 74AUP1G58GS,132 ( 9352 928 68132 ) |
74AUP1G58GW | TSSOP6 (SOT363-2) | SOT363-2 | SOT363-2_125 | Active | aK | 74AUP1G58GW,125 ( 9352 799 59125 ) | |
74AUP1G58GX | X2SON6 (SOT1255-2) | SOT1255-2 | SOT1255-2_147 | Active | aK | 74AUP1G58GXZ ( 9353 071 22147 ) |
Discontinuation information
Type number | Orderable part number, (Ordering code (12NC)) | Last time buy date | Last time delivery date | Replacement product | Status | Comments |
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74AUP1G58GX | 935307122125 |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator | Leadfree conversion date |
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74AUP1G58GM | 74AUP1G58GM,132 | 74AUP1G58GM | Always Pb-free | ||
74AUP1G58GM | 74AUP1G58GM,115 | 74AUP1G58GM | Always Pb-free | ||
74AUP1G58GN | 74AUP1G58GN,132 | 74AUP1G58GN | Always Pb-free | ||
74AUP1G58GS | 74AUP1G58GS,132 | 74AUP1G58GS | Always Pb-free | ||
74AUP1G58GW | 74AUP1G58GW,125 | 74AUP1G58GW | Always Pb-free | ||
74AUP1G58GX | 74AUP1G58GXZ | 74AUP1G58GX | Always Pb-free |
Documentation (17)
File name | Title | Type | Date |
---|---|---|---|
74AUP1G58 | Low-power configurable multiple function gate | Data sheet | 2023-07-24 |
aup1g58 | aup1g58 IBIS model | IBIS model | 2015-09-06 |
Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
Nexperia_document_leaflet_Logic_SingleConfigurableLogic_201812 | Single configurable logic | Leaflet | 2019-01-04 |
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Leaflet | 2019-04-12 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
SOT1255-2 | plastic thermal enhanced extremely thin small outline package; no leads;6 terminals; body 1.0 x 0.8 x 0.32 mm | Package information | 2020-08-27 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT1115 | MAR_SOT1115 Topmark | Top marking | 2013-06-03 |
SOT1115 | plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Package information | 2022-05-27 |
MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
Support
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Models
File name | Title | Type | Date |
---|---|---|---|
aup1g58 | aup1g58 IBIS model | IBIS model | 2015-09-06 |
Ordering, pricing & availability
Sample
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