Features and benefits
- Wide supply voltage range from 0.8 V to 3.6 V
- High noise immunity
- ESD protection:
- HBM JESD22-A114F exceeds 5000 V
- MM JESD22-A115-A exceeds 200 V
- CDM JESD22-C101E exceeds 1000 V
- Low static power consumption; ICC = 0.9 μA (maximum)
- Latch-up performance exceeds 100 mA per JESD 78 Class II
- Inputs accept voltages up to 3.6 V
- Low noise overshoot and undershoot < 10 % of VCC
- IOFF circuitry provides partial power-down mode operation
- Multiple package options
- Specified from ‑40 °C to +85 °C and ‑40 °C to +125 °C
Parametrics
Type number | Product status | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
74AUP2G97DP | Production | n.a. | n.a. | CMOS | ± 1.9 | 8.7 | 70 | 2 | ultra low | -40~125 | 120 | 30.0 | TSSOP10 |
74AUP2G97GU | Production | n.a. | n.a. | CMOS | ± 1.9 | 8.7 | 70 | 2 | ultra low | -40~125 | 142 | 48.0 | XQFN10 |
Package
Type number | Package | Package information | Reflow-/Wave soldering | Packing | Status | Marking | Orderable part number, (Ordering code (12NC)) |
---|---|---|---|---|---|---|---|
74AUP2G97DP | TSSOP10 (SOT552-1) | SOT552-1 | SSOP-TSSOP-VSO-WAVE | SOT552-1_118 | Active | aV | 74AUP2G97DPJ ( 9353 044 81118 ) |
74AUP2G97GU | XQFN10 (SOT1160-1) | SOT1160-1 | SOT1160-1_115 | Active | aV | 74AUP2G97GUX ( 9353 044 84115 ) |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator | Leadfree conversion date |
---|---|---|---|---|---|
74AUP2G97DP | 74AUP2G97DPJ | 74AUP2G97DP | Always Pb-free | ||
74AUP2G97GU | 74AUP2G97GUX | 74AUP2G97GU | Always Pb-free |
Documentation (6)
File name | Title | Type | Date |
---|---|---|---|
74AUP2G97 | Low-power dual PCB configurable multiple function gate | Data sheet | 2023-08-01 |
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Leaflet | 2019-04-12 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
SOT552-1 | plastic, thin shrink small outline package; 10 leads; 0.5 mm pitch; 3 mm x 3 mm x 1.1 mm body | Package information | 2022-06-07 |
SOT1160-1 | plastic, leadless extremely thin quad flat package; 10 terminals; 0.4 mm pitch; 1.4 mm x 1.8 mm x 0.5 mm body | Package information | 2022-06-07 |
Support
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Ordering, pricing & availability
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