Features and benefits
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Wide supply voltage range from 1.0 V to 5.5 V
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CMOS low power dissipation
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Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
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Optimized for low voltage applications: 1.0 V to 3.6 V
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Accepts TTL input levels between VCC = 2.7 V and VCC = 3.6 V
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Typical output ground bounce < 0.8 V at VCC = 3.3 V and Tamb = 25 °C
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Typical HIGH-level output voltage (VOH) undershoot: > 2 V at VCC = 3.3 V and Tamb = 25 °C
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Complies with JEDEC standards:
- JESD8-7 (1.65 V to 1.95 V)
- JESD8-5 (2.3 V to 2.7 V)
- JESD8C (2.7 V to 3.6 V)
- JESD36 (4.5 V to 5.5 V)
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ESD protection:
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HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
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CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
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Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Parametrics
Type number | Product status | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
74LV245D | Production | n.a. | n.a. | TTL | ± 16 | 7.0 | 8 | 30 | low | -40~125 | 74 | 50 | SO20 |
74LV245PW | Production | n.a. | n.a. | TTL | ± 16 | 7.0 | 8 | 30 | low | -40~125 | 93 | 36.4 | TSSOP20 |
Package
Type number | Package | Package information | Reflow-/Wave soldering | Packing | Status | Marking | Orderable part number, (Ordering code (12NC)) |
---|---|---|---|---|---|---|---|
74LV245D | SO20 (SOT163-1) | SOT163-1 | WAVE_BG-BD-1 | SOT163-1_118 | Active | 74LV245D | 74LV245D,118 ( 9350 632 10118 ) |
74LV245PW | TSSOP20 (SOT360-1) | SOT360-1 | SSOP-TSSOP-VSO-WAVE | SOT360-1_118 | Active | LV245 | 74LV245PW,118 ( 9351 746 60118 ) |
The variants in the table below are discontinued. See the table Discontinuation information for more information.
Type number | Package | Package information | Reflow-/Wave soldering | Packing | Status | Marking | Orderable part number, (Ordering code (12NC)) |
---|---|---|---|---|---|---|---|
74LV245PW | TSSOP20 (SOT360-1) | SOT360-1 | SSOP-TSSOP-VSO-WAVE | SOT360-1_112 | Withdrawn / End-of-life | LV245 | 74LV245PW,112 ( 9351 746 60112 ) |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator | Leadfree conversion date |
---|---|---|---|---|---|
74LV245D | 74LV245D,118 | 74LV245D | week 30, 2004 | ||
74LV245PW | 74LV245PW,118 | 74LV245PW | week 7, 2005 |
The variants in the table below are discontinued. See the table Discontinuation information for more information.
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator | Leadfree conversion date |
---|---|---|---|---|---|
74LV245PW | 74LV245PW,112 | 74LV245PW | week 7, 2005 |
Documentation (8)
File name | Title | Type | Date |
---|---|---|---|
74LV245 | Octal bus transceiver; 3-state | Data sheet | 2024-07-04 |
lv245 | 74LV245 IBIS model | IBIS model | 2019-01-09 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
lv | lv Spice model | SPICE model | 2013-05-06 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Package information | 2022-06-21 |
SOT163-1 | plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body | Package information | 2022-06-20 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
Support
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Sample
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