Features and benefits
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Wide supply voltage range:
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VCC(A): 1.65 V to 3.6 V and VCC(B): 2.3 V to 5.5 V
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Maximum data rates:
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Push-pull: 24 Mbps
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IOFF circuitry provides partial Power-down mode operation
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Inputs accept voltages up to 5.5 V
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ESD protection:
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HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2500 V for A port
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HBM: ANSI/ESDA/JEDEC JS-001 class 3B exceeds 15000 V for B port
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CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
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IEC61000-4-2 contact discharge exceeds 8000 V for B port
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Latch-up performance exceeds 100 mA per JESD 78B Class II
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Multiple package options
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Specified from -40 °C to +85 °C and -40 °C to +125 °C
Applications
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Desktop PC
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Handset
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Smartphone
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Tablet
Parametrics
Type number | Product status | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXS0104BQ | Production | 1.65 - 3.6 | 2.3 - 5.5 | CMOS | - 0.02 / 1.0 | 6.0 | 4 | low | -40~125 | 96 | 12.8 | 64 | DHVQFN14 |
NXS0104GU12 | Production | 1.65 - 3.6 | 2.3 - 5.5 | CMOS | - 0.02 / 1.0 | 6.0 | 4 | low | -40~125 | 135 | 4.2 | 58 | XQFN12 |
NXS0104PW | Production | 1.65 - 3.6 | 2.3 - 5.5 | CMOS | - 0.02 / 1.0 | 6.0 | 4 | low | -40~125 | 133 | 4.9 | 58 | TSSOP14 |
NXS0104UM | Production | 1.65 - 3.6 | 2.3 - 5.5 | CMOS | - 0.02 / 1.0 | 6.0 | 4 | low | -40~125 | 137 | - | 31 | WLCSP12 |
Package
Type number | Package | Package information | Reflow-/Wave soldering | Packing | Status | Marking | Orderable part number, (Ordering code (12NC)) |
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NXS0104BQ | DHVQFN14 (SOT762-1) | SOT762-1 | SOT762-1_115 | Active | S0104 | NXS0104BQX ( 9356 906 92115 ) | |
NXS0104GU12 | XQFN12 (SOT1174-1) | SOT1174-1 | SOT1174-1_115 | Active | Standard Marking | NXS0104GU12X ( 9356 906 93115 ) | |
NXS0104PW | TSSOP14 (SOT402-1) | SOT402-1 | SSOP-TSSOP-VSO-WAVE | SOT402-1_118 | Active | NXS0104 | NXS0104PWJ ( 9356 906 91118 ) |
NXS0104UM | WLCSP12 (SOT8019-1) | SOT8019-1 | SOT8019-1_336 | Active | m4 | NXS0104UMAZ ( 9356 911 08336 ) |
The variants in the table below are discontinued. See the table Discontinuation information for more information.
Type number | Package | Package information | Reflow-/Wave soldering | Packing | Status | Marking | Orderable part number, (Ordering code (12NC)) |
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NXS0104UM | WLCSP12 (SOT8019-1) | SOT8019-1 | SOT8019-1_084 | Withdrawn / End-of-life | m4 | NXS0104UMZ ( 9356 911 08084 ) |
Discontinuation information
Type number | Orderable part number, (Ordering code (12NC)) | Last time buy date | Last time delivery date | Replacement product | Status | Comments |
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NXS0104UM | 935691108084 |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator | Leadfree conversion date |
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NXS0104BQ | NXS0104BQX | NXS0104BQ | week 25, 2019 | ||
NXS0104GU12 | NXS0104GU12X | NXS0104GU12 | week 25, 2019 | ||
NXS0104PW | NXS0104PWJ | NXS0104PW | week 25, 2019 | ||
NXS0104UM | NXS0104UMAZ | NXS0104UM |
The variants in the table below are discontinued. See the table Discontinuation information for more information.
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator | Leadfree conversion date |
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NXS0104UM | NXS0104UMZ | NXS0104UM |
Documentation (7)
File name | Title | Type | Date |
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NXS0104 | Dual supply translating transceiver; open drain; auto direction sensing | Data sheet | 2024-04-04 |
nxs0104 | NXS0104 IBIS model | IBIS model | 2020-11-05 |
SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | Package information | 2023-04-05 |
SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
SOT1174-1 | plastic, leadless extremely thin quad flat package; 12 terminals; 0.4 mm pitch; 2 mm x 1.7 mm x 0.5 mm body | Package information | 2024-04-11 |
SOT8019-1 (Working Copy) | wafer level chip-scale package, 12 bumps; 1.36 x 1.86 x 0.60 mm | Package information | 2022-02-11 |
Support
If you are in need of design/technical support, let us know and fill in the answer form, we'll get back to you shortly.
Models
File name | Title | Type | Date |
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nxs0104 | NXS0104 IBIS model | IBIS model | 2020-11-05 |
Ordering, pricing & availability
Sample
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If you do not have a direct account with Nexperia our network of global and regional distributors is available and equipped to support you with Nexperia samples. Check out the list of official distributors.