Features and benefits
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Wide supply voltage range from 0.8 V to 3.6 V
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CMOS low power dissipation
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High noise immunity
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Overvoltage tolerant inputs to 3.6 V
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Low static power consumption; ICC = 0.9 μA (maximum)
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Latch-up performance exceeds 100 mA per JESD 78 Class II
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Low noise overshoot and undershoot < 10 % of VCC
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IOFF circuitry provides partial Power-down mode operation
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Complies with JEDEC standards:
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JESD8-12 (0.8 V to 1.3 V)
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JESD8-11 (0.9 V to 1.65 V)
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JESD8-7 (1.2 V to 1.95 V)
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JESD8-5 (1.8 V to 2.7 V)
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JESD8C (2.7 V to 3.6 V)
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ESD protection:
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HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V
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CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
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Multiple package options
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Specified from -40 °C to +85 °C and -40 °C to +125 °C
Parametrics
Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|---|
74AUP1G74DC | Production | 0.8 - 3.6 | CMOS | ± 1.9 | 9.2 | 400 | ultra low | -40~125 | 203 | 34.1 | 113 | VSSOP8 |
74AUP1G74GN | Production | 0.8 - 3.6 | CMOS | ± 1.9 | 9.2 | 400 | ultra low | -40~125 | 238 | 10.6 | 148 | XSON8 |
74AUP1G74GS | Production | 0.8 - 3.6 | CMOS | ± 1.9 | 9.2 | 400 | ultra low | -40~125 | 276 | 10.8 | 146 | XSON8 |
74AUP1G74GT | Production | 0.8 - 3.6 | CMOS | ± 1.9 | 9.2 | 400 | ultra low | -40~125 | 327 | 6.1 | 157 | XSON8 |
74AUP1G74GX | Production | 0.8 - 3.6 | CMOS | ± 1.9 | 9.2 | 400 | ultra low | -40~125 | 256 | 6.5 | 148 | X2SON8 |
Package
Type number | Package | Package information | Reflow-/Wave soldering | Packing | Status | Marking | Orderable part number, (Ordering code (12NC)) |
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74AUP1G74DC | VSSOP8 (SOT765-1) | SOT765-1 | SOT765-1_125 | Active | p74 | 74AUP1G74DC,125 ( 9352 807 17125 ) | |
74AUP1G74GN | XSON8 (SOT1116) | SOT1116 | REFLOW_BG-BD-1 | SOT1116_115 | Active | 54 | 74AUP1G74GN,115 ( 9352 922 15115 ) |
74AUP1G74GS | XSON8 (SOT1203) | SOT1203 | REFLOW_BG-BD-1 | SOT1203_115 | Active | 54 | 74AUP1G74GS,115 ( 9352 927 75115 ) |
74AUP1G74GT | XSON8 (SOT833-1) | SOT833-1 | SOT833-1_115 | Active | p74 | 74AUP1G74GT,115 ( 9352 807 18115 ) | |
74AUP1G74GX | X2SON8 (SOT1233-2) | SOT1233-2 | SOT1233-2_115 | Active | 54 | 74AUP1G74GXX ( 9353 084 41115 ) |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator | Leadfree conversion date |
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74AUP1G74DC | 74AUP1G74DC,125 | 74AUP1G74DC | Always Pb-free | ||
74AUP1G74GN | 74AUP1G74GN,115 | 74AUP1G74GN | Always Pb-free | ||
74AUP1G74GS | 74AUP1G74GS,115 | 74AUP1G74GS | Always Pb-free | ||
74AUP1G74GT | 74AUP1G74GT,115 | 74AUP1G74GT | Always Pb-free | ||
74AUP1G74GX | 74AUP1G74GXX | 74AUP1G74GX | week 25, 2019 |
Documentation (17)
File name | Title | Type | Date |
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74AUP1G74 | Low-power D-type flip-flop with set and reset; positive-edge trigger | Data sheet | 2023-07-14 |
AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
AN11052 | Pin FMEA for AUP family | Application note | 2019-01-09 |
aup1g74 | aup1g74 IBIS model | IBIS model | 2013-04-07 |
Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Leaflet | 2019-04-12 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
SOT1233-2 | plastic thermal enhanced extremely thin small outline package; no leads;8 terminals; body 1.35 x 0.8 x 0.32 mm | Package information | 2022-04-21 |
MAR_SOT1203 | MAR_SOT1203 Topmark | Top marking | 2013-06-03 |
SOT1203 | plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body | Package information | 2022-06-03 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT833 | MAR_SOT833 Topmark | Top marking | 2013-06-03 |
SOT833-1 | plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1 mm x 1.95 mm x 0.5 mm body | Package information | 2022-06-03 |
SOT765-1 | plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body | Package information | 2022-06-03 |
MAR_SOT1116 | MAR_SOT1116 Topmark | Top marking | 2013-06-03 |
SOT1116 | plastic, leadless extremely thin small outline package; 8 terminals; 0.3 mm pitch; 1.2 mm x 1 mm x 0.35 mm body | Package information | 2022-06-02 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
Support
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Models
File name | Title | Type | Date |
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aup1g74 | aup1g74 IBIS model | IBIS model | 2013-04-07 |
Ordering, pricing & availability
Sample
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