Features and benefits
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Wide supply voltage range from 1.65 V to 5.5 V
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5 V tolerant outputs for interfacing with 5 V logic
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Overvoltage tolerant inputs to 5.5 V
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High noise immunity
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±24 mA output drive (VCC = 3.0 V)
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CMOS low power consumption
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IOFF circuitry provides partial Power-down mode operation
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Latch-up performance exceeds 250 mA
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Direct interface with TTL levels
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Complies with JEDEC standard:
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JESD8-7 (1.65 V to 1.95 V)
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JESD8-5 (2.3 V to 2.7 V)
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JESD8-B/JESD36 (2.7 V to 3.6 V)
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ESD protection:
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HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
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CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
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Multiple package options
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Specified from -40 °C to +85 °C and -40 °C to +125 °C
Parametrics
Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
74LVC2G02DC | Production | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 2.4 | 150 | 2 | low | -40~125 | 200 | 32.4 | 110 | VSSOP8 |
74LVC2G02DP | Production | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 2.4 | 150 | 2 | low | -40~125 | 210 | 18.8 | 104 | TSSOP8 |
74LVC2G02GN | Production | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 2.4 | 150 | 2 | low | -40~125 | 231 | 9.5 | 142 | XSON8 |
74LVC2G02GS | Production | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 2.4 | 150 | 2 | low | -40~125 | 269 | 9.7 | 141 | XSON8 |
74LVC2G02GT | Production | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 2.4 | 150 | 2 | low | -40~125 | 317 | 5.6 | 150 | XSON8 |
Package
Type number | Package | Package information | Reflow-/Wave soldering | Packing | Status | Marking | Orderable part number, (Ordering code (12NC)) |
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74LVC2G02DC | VSSOP8 (SOT765-1) | SOT765-1 | SOT765-1_125 | Active | V02 | 74LVC2G02DC,125 ( 9352 746 87125 ) | |
74LVC2G02DP | TSSOP8 (SOT505-2) | SOT505-2 | SOT505-2_125 | Active | V02 | 74LVC2G02DP,125 ( 9352 735 79125 ) | |
74LVC2G02GN | XSON8 (SOT1116) | SOT1116 | REFLOW_BG-BD-1 | SOT1116_115 | Active | VB | 74LVC2G02GN,115 ( 9352 922 37115 ) |
74LVC2G02GS | XSON8 (SOT1203) | SOT1203 | REFLOW_BG-BD-1 | SOT1203_115 | Active | VB | 74LVC2G02GS,115 ( 9352 923 71115 ) |
74LVC2G02GT | XSON8 (SOT833-1) | SOT833-1 | SOT833-1_115 | Active | V02 | 74LVC2G02GT,115 ( 9352 789 19115 ) |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator | Leadfree conversion date |
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74LVC2G02DC | 74LVC2G02DC,125 | 74LVC2G02DC | week 1, 2005 | ||
74LVC2G02DP | 74LVC2G02DP,125 | 74LVC2G02DP | week 41, 2004 | ||
74LVC2G02GN | 74LVC2G02GN,115 | 74LVC2G02GN | Always Pb-free | ||
74LVC2G02GS | 74LVC2G02GS,115 | 74LVC2G02GS | Always Pb-free | ||
74LVC2G02GT | 74LVC2G02GT,115 | 74LVC2G02GT | Always Pb-free |
Documentation (15)
File name | Title | Type | Date |
---|---|---|---|
74LVC2G02 | Dual 2-input NOR gate | Data sheet | 2023-08-15 |
AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
lvc2g02 | 74LVC2G02 IBIS model | IBIS model | 2014-10-20 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
SOT505-2 | plastic, thin shrink small outline package; 8 leads; 0.65 mm pitch; 3 mm x 3 mm x 1.1 mm body | Package information | 2022-06-03 |
MAR_SOT1203 | MAR_SOT1203 Topmark | Top marking | 2013-06-03 |
SOT1203 | plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body | Package information | 2022-06-03 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT833 | MAR_SOT833 Topmark | Top marking | 2013-06-03 |
SOT833-1 | plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1 mm x 1.95 mm x 0.5 mm body | Package information | 2022-06-03 |
SOT765-1 | plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body | Package information | 2022-06-03 |
MAR_SOT1116 | MAR_SOT1116 Topmark | Top marking | 2013-06-03 |
SOT1116 | plastic, leadless extremely thin small outline package; 8 terminals; 0.3 mm pitch; 1.2 mm x 1 mm x 0.35 mm body | Package information | 2022-06-02 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
Support
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Models
File name | Title | Type | Date |
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lvc2g02 | 74LVC2G02 IBIS model | IBIS model | 2014-10-20 |
Ordering, pricing & availability
Sample
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If you do not have a direct account with Nexperia our network of global and regional distributors is available and equipped to support you with Nexperia samples. Check out the list of official distributors.