Features and benefits
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Automotive product qualification in accordance with AEC-Q100 (Grade 1)
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Specified from -40 °C to +85 °C and from -40 °C to +125 °C
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Supply voltage range from 2.3 V to 3.6 V
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Overvoltage tolerant control inputs to 3.6 V
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High noise immunity
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Complies with JEDEC standard:
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JESD8-5 (2.3 V to 2.7 V)
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JESD8C (2.7 V to 3.6 V)
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5 Ω switch connection between two ports
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Rail to rail switching on data I/O ports
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CMOS low power consumption
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Latch-up performance meets requirements of JESD78 Class I
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IOFF circuitry provides partial Power-down mode operation
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ESD protection:
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HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
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CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
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Parametrics
Type number | Product status | VCC (V) | RON (Ω) | Logic switching levels | tpd (ns) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
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74CBTLV1G125GV-Q100 | Production | 2.3 - 3.6 | 7 | CMOS/LVTTL | 0.2 | very low | -40~125 | 259 | 56.6 | 160 | TSOP5 |
74CBTLV1G125GW-Q100 | Production | 2.3 - 3.6 | 7 | CMOS/LVTTL | 0.2 | very low | -40~125 | 300 | 71.7 | 171 | TSSOP5 |
Package
Type number | Package | Package information | Reflow-/Wave soldering | Packing | Status | Marking | Orderable part number, (Ordering code (12NC)) |
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74CBTLV1G125GV-Q100 | TSOP5 (SOT753) | SOT753 | REFLOW_BG-BD-1 WAVE_BG-BD-1 | SOT753_125 | Active | b25 | 74CBTLV1G125GV-Q1H ( 9356 918 28125 ) |
74CBTLV1G125GW-Q100 | TSSOP5 (SOT353-1) | SOT353-1 | WAVE_BG-BD-1 | SOT353-1_125 | Active | bM | 74CBTLV1G125GW-Q1H ( 9356 918 30125 ) |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator | Leadfree conversion date |
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74CBTLV1G125GV-Q100 | 74CBTLV1G125GV-Q1H | 74CBTLV1G125GV-Q100 | |||
74CBTLV1G125GW-Q100 | 74CBTLV1G125GW-Q1H | 74CBTLV1G125GW-Q100 |
Documentation (7)
File name | Title | Type | Date |
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74CBTLV1G125_Q100 | Single bus switch | Data sheet | 2024-06-24 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SOT353-1 | plastic thin shrink small outline package; 5 leads; body width 1.25 mm | Package information | 2022-11-15 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT753 | MAR_SOT753 Topmark | Top marking | 2013-06-03 |
SOT753 | plastic, surface-mounted package; 5 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body | Package information | 2022-05-31 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
Support
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Ordering, pricing & availability
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