Features and benefits
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Automotive product qualification in accordance with AEC-Q100 (Grade 1)
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Specified from -40 °C to +85 °C and from -40 °C to +125 °C
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Supply voltage range from 2.3 V to 3.6 V
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High noise immunity
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Complies with JEDEC standard:
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JESD8-5 (2.3 V to 2.7 V)
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JESD8-B/JESD36 (2.7 V to 3.6 V)
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5 Ω switch connection between two ports
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Rail to rail switching on data I/O ports
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CMOS low power consumption
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Latch-up performance exceeds 250 mA per JESD78B Class I level A
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IOFF circuitry provides partial Power-down mode operation
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DHVQFN package with Side-Wettable Flanks enabling Automated Optical Inspection (AOI) of solder joints
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ESD protection:
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HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
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CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
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Parametrics
Type number | Product status | VCC (V) | RON (Ω) | Logic switching levels | tpd (ns) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
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74CBTLV3245BQ-Q100 | Production | 2.3 - 3.6 | 7 | CMOS/LVTTL | 0.2 | very low | -40~125 | 76 | 7.3 | 47 | DHVQFN20 |
74CBTLV3245PW-Q100 | Production | 2.3 - 3.6 | 7 | CMOS/LVTTL | 0.2 | very low | -40~125 | 99 | 4.3 | 43.4 | TSSOP20 |
Package
Type number | Package | Package information | Reflow-/Wave soldering | Packing | Status | Marking | Orderable part number, (Ordering code (12NC)) |
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74CBTLV3245BQ-Q100 | DHVQFN20 (SOT764-1) | SOT764-1 | SOT764-1_115 | Active | BTLV3245 | 74CBTLV3245BQ-Q10X ( 9353 085 27115 ) | |
74CBTLV3245PW-Q100 | TSSOP20 (SOT360-1) | SOT360-1 | SSOP-TSSOP-VSO-WAVE | SOT360-1_118 | Active | TLV3245 | 74CBTLV3245PW-Q10J ( 9353 085 26118 ) |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator | Leadfree conversion date |
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74CBTLV3245BQ-Q100 | 74CBTLV3245BQ-Q10X | 74CBTLV3245BQ-Q100 | week 25, 2019 | ||
74CBTLV3245PW-Q100 | 74CBTLV3245PW-Q10J | 74CBTLV3245PW-Q100 | week 25, 2019 |
Documentation (6)
File name | Title | Type | Date |
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74CBTLV3245_Q100 | 8-bit bus switch with output enable | Data sheet | 2024-06-24 |
cbtlv3245 | 74CBTLV3245 IBIS Model | IBIS model | 2013-11-10 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Package information | 2022-06-21 |
Support
If you are in need of design/technical support, let us know and fill in the answer form, we'll get back to you shortly.
Models
File name | Title | Type | Date |
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cbtlv3245 | 74CBTLV3245 IBIS Model | IBIS model | 2013-11-10 |
Ordering, pricing & availability
Sample
As a Nexperia customer you can order samples via our sales organization.
If you do not have a direct account with Nexperia our network of global and regional distributors is available and equipped to support you with Nexperia samples. Check out the list of official distributors.