Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74AUP1G08GZ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AUP1G08GZSOT8065-1XSON51.24304 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9356915263153126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04418100.000003.55449
subTotal0.04418100.000003.55449
ComponentAdditiveNon hazardousProprietary0.001105.000000.08849
FillerBisphenol A-epichlorohydrin resin25068-38-60.001105.000000.08849
Silica -amorphous-7631-86-90.0110050.000000.88493
PolymerEpoxy resin systemProprietary0.0066030.000000.53096
Phenol Formaldehyde resin (generic)9003-35-40.0022010.000000.17699
subTotal0.02200100.000001.76986
Lead FrameCopper alloyCopper (Cu)7440-50-80.4422394.9000035.57681
Magnesium (Mg)7439-95-40.000700.150000.05623
Nickel (Ni)7440-02-00.013792.960001.10967
Silicon (Si)7440-21-30.002980.640000.23993
Pure metal layerGold (Au)7440-57-50.000090.020000.00750
Nickel (Ni)7440-02-00.005961.280000.47986
Palladium (Pd)7440-05-30.000230.050000.01874
subTotal0.46600100.0000037.48874
Mould CompoundAdditiveNon hazardousProprietary0.002780.410000.22330
FillerSilica -amorphous-7631-86-90.001960.290000.15794
Silica fused60676-86-00.5832486.1500046.92009
HardenerPhenolic resinProprietary0.029044.290002.33647
PigmentCarbon black1333-86-40.001290.190000.10348
PolymerEpoxy resin systemProprietary0.058708.670004.72196
subTotal0.67700100.0000054.46324
Post-PlatingImpurityNon hazardousProprietary0.000000.010000.00018
Tin alloyTin (Sn)7440-31-50.0220099.990001.76968
subTotal0.02200100.000001.76986
WireImpurityNon hazardousProprietary0.000000.010000.00010
Pure metalCopper (Cu)7440-50-80.0114496.490000.92013
Pure metal layerGold (Au)7440-57-50.000060.500000.00477
Palladium (Pd)7440-05-30.000363.000000.02861
subTotal0.01185100.000000.95361
total1.24304100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.