Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PH2625L

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PH2625LSOT669LFPAK83.45000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93405820211523126030 s126020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-33.80000100.000004.55362
subTotal3.80000100.000004.55362
ClipCopper alloyChromium (Cr)7440-47-30.015000.300000.01797
Copper (Cu)7440-50-84.9790099.580005.96645
Silicon (Si)7440-21-30.001000.020000.00120
Titanium (Ti)7440-32-60.005000.100000.00599
subTotal5.00000100.000005.99161
Lead FrameCopper alloyCopper (Cu)7440-50-837.8379799.8100045.34209
Iron (Fe)7439-89-60.056860.150000.06814
Phosphorus (P)7723-14-00.015160.040000.01817
subTotal37.91000100.0000045.42840
Mould CompoundFillerSilica fused60676-86-013.7433061.0000016.46890
Flame retardantZinc Borate138265-88-02.2530010.000002.69982
PigmentCarbon black1333-86-40.067590.300000.08099
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-24.4384119.700005.31865
Phenolic resinProprietary2.027709.000002.42984
subTotal22.53000100.0000026.99820
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00046
Tin alloyTin (Sn)7440-31-53.8496299.990004.61308
subTotal3.85000100.000004.61354
Solder PasteLead alloyLead (Pb)7439-92-19.5830092.5000011.48352
Silver (Ag)7440-22-40.259002.500000.31037
Tin (Sn)7440-31-50.518005.000000.62073
subTotal10.36000100.0000012.41462
total83.45000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.