Features and benefits
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Wide supply voltage range from 1.65 V to 5.5 V
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Overvoltage tolerant inputs to 5.5 V
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High noise immunity
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±24 mA output drive (VCC = 3.0 V)
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CMOS low power dissipation
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Latch-up performance exceeds 250 mA
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Direct interface with TTL levels
- IOFF circuitry provides partial Power-down mode operation
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Complies with JEDEC standard:
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JESD8-7 (1.65 V to 1.95 V)
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JESD8-5 (2.3 V to 2.7 V)
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JESD8C (2.7 V to 3.6 V)
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JESD36 (4.5 V to 5.5 V)
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ESD protection:
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HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
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CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
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Multiple package options
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Specified from -40 °C to +85 °C and -40 °C to +125 °C.
Parametrics
Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|
74LVC1G19GM | Production | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 1.8 | low | -40~125 | 314 | 7.9 | 159 | XSON6 |
74LVC1G19GN | Production | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 1.8 | low | -40~125 | 342 | 24.3 | 212 | XSON6 |
74LVC1G19GS | Production | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 1.8 | low | -40~125 | 328 | 30.8 | 220 | XSON6 |
74LVC1G19GV | Production | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 1.8 | low | -40~125 | 257 | 60.2 | 169 | TSOP6 |
74LVC1G19GW | Production | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 1.8 | low | -40~125 | 282 | 54.1 | 169 | TSSOP6 |
Package
Type number | Package | Package information | Reflow-/Wave soldering | Packing | Status | Marking | Orderable part number, (Ordering code (12NC)) |
---|---|---|---|---|---|---|---|
74LVC1G19GM | XSON6 (SOT886) | SOT886 | REFLOW_BG-BD-1 | SOT886_115 | Active | VY | 74LVC1G19GM,115 ( 9352 780 79115 ) |
SOT886_132 | Active | VY | 74LVC1G19GM,132 ( 9352 780 79132 ) | ||||
74LVC1G19GN | XSON6 (SOT1115) | SOT1115 | REFLOW_BG-BD-1 | SOT1115_132 | Active | VY | 74LVC1G19GN,132 ( 9352 917 82132 ) |
74LVC1G19GS | XSON6 (SOT1202) | SOT1202 | REFLOW_BG-BD-1 | SOT1202_132 | Active | VY | 74LVC1G19GS,132 ( 9352 929 07132 ) |
74LVC1G19GV | TSOP6 (SOT457) | SOT457 | REFLOW_BG-BD-1 WAVE_BG-BD-1 | SOT457_125 | Active | V19 | 74LVC1G19GV,125 ( 9352 734 69125 ) |
74LVC1G19GW | TSSOP6 (SOT363-2) | SOT363-2 | SOT363-2_125 | Active | VY | 74LVC1G19GW,125 ( 9352 734 68125 ) |
Discontinuation information
Type number | Orderable part number, (Ordering code (12NC)) | Last time buy date | Last time delivery date | Replacement product | Status | Comments |
---|---|---|---|---|---|---|
74LVC1G19GM | 935278079125 |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator | Leadfree conversion date |
---|---|---|---|---|---|
74LVC1G19GM | 74LVC1G19GM,115 | 74LVC1G19GM | Always Pb-free | ||
74LVC1G19GM | 74LVC1G19GM,132 | 74LVC1G19GM | Always Pb-free | ||
74LVC1G19GN | 74LVC1G19GN,132 | 74LVC1G19GN | Always Pb-free | ||
74LVC1G19GS | 74LVC1G19GS,132 | 74LVC1G19GS | Always Pb-free | ||
74LVC1G19GV | 74LVC1G19GV,125 | 74LVC1G19GV | Always Pb-free | ||
74LVC1G19GW | 74LVC1G19GW,125 | 74LVC1G19GW | Always Pb-free |
Documentation (19)
File name | Title | Type | Date |
---|---|---|---|
74LVC1G19 | 1-of-2 decoder/demultiplexer | Data sheet | 2023-08-16 |
AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
lvc1g19 | 74LVC1G19 IBIS model | IBIS model | 2014-10-20 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT1115 | MAR_SOT1115 Topmark | Top marking | 2013-06-03 |
SOT1115 | plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Package information | 2022-05-27 |
MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT457 | MAR_SOT457 Topmark | Top marking | 2013-06-03 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SOT457 | plastic, surface-mounted package (SC-74; TSOP6); 6 leads | Package information | 2023-03-03 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
Support
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Models
File name | Title | Type | Date |
---|---|---|---|
lvc1g19 | 74LVC1G19 IBIS model | IBIS model | 2014-10-20 |
Ordering, pricing & availability
Sample
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