Features and benefits
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Wide supply voltage range from 2.3 V to 3.6 V
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CMOS low power dissipation
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High noise immunity
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Complies with JEDEC standards
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JESD8-12 (0.8 V to 1.3 V)
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JESD8-11 (0.9 V to 1.65 V)
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JESD8-7 (1.65 V to 1.95 V)
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JESD8-5 (2.3 V to 2.7 V)
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JESD8C (2.7 V to 3.6 V)
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Low static power consumption; ICC = 1.5 μA (maximum)
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Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
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Overvoltage tolerant inputs to 3.6 V
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Low noise overshoot and undershoot < 10 % of VCC
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IOFF circuitry provides partial Power-down mode operation
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ESD protection:
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HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V
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CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
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Multiple package options
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Specified from -40 °C to +85 °C and -40 °C to +125 °C
Parametrics
Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
74AUP1T98GM | Production | 2.3 - 3.6 | CMOS | ± 4 | 3.9 | 70 | 1 | ultra low | -40~125 | 290 | 6.5 | 145 | XSON6 |
74AUP1T98GN | Production | 2.3 - 3.6 | CMOS | ± 4 | 3.9 | 70 | 1 | ultra low | -40~125 | 275 | 11.7 | 171 | XSON6 |
74AUP1T98GS | Production | 2.3 - 3.6 | CMOS | ± 4 | 3.9 | 70 | 1 | ultra low | -40~125 | 272 | 14.8 | 177 | XSON6 |
74AUP1T98GW | Production | 2.3 - 3.6 | CMOS | ± 4 | 3.9 | 70 | 1 | ultra low | -40~125 | 264 | 38.6 | 153 | TSSOP6 |
Package
Type number | Package | Package information | Reflow-/Wave soldering | Packing | Status | Marking | Orderable part number, (Ordering code (12NC)) |
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74AUP1T98GM | XSON6 (SOT886) | SOT886 | REFLOW_BG-BD-1 | SOT886_132 | Active | aR | 74AUP1T98GM,132 ( 9352 804 72132 ) |
SOT886_115 | Active | aR | 74AUP1T98GM,115 ( 9352 804 72115 ) | ||||
74AUP1T98GN | XSON6 (SOT1115) | SOT1115 | REFLOW_BG-BD-1 | SOT1115_132 | Active | aR | 74AUP1T98GN,132 ( 9352 917 56132 ) |
74AUP1T98GS | XSON6 (SOT1202) | SOT1202 | REFLOW_BG-BD-1 | SOT1202_132 | Active | aR | 74AUP1T98GS,132 ( 9352 928 82132 ) |
74AUP1T98GW | TSSOP6 (SOT363-2) | SOT363-2 | SOT363-2_125 | Active | aR | 74AUP1T98GW,125 ( 9352 804 71125 ) |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator | Leadfree conversion date |
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74AUP1T98GM | 74AUP1T98GM,132 | 74AUP1T98GM | Always Pb-free | ||
74AUP1T98GM | 74AUP1T98GM,115 | 74AUP1T98GM | Always Pb-free | ||
74AUP1T98GN | 74AUP1T98GN,132 | 74AUP1T98GN | Always Pb-free | ||
74AUP1T98GS | 74AUP1T98GS,132 | 74AUP1T98GS | Always Pb-free | ||
74AUP1T98GW | 74AUP1T98GW,125 | 74AUP1T98GW | Always Pb-free |
Documentation (15)
File name | Title | Type | Date |
---|---|---|---|
74AUP1T98 | Low-power configurable gate with voltage-level translator | Data sheet | 2023-07-17 |
AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
aup1t98 | aup1t98 IBIS model | IBIS model | 2014-12-21 |
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Leaflet | 2019-04-12 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT1115 | MAR_SOT1115 Topmark | Top marking | 2013-06-03 |
SOT1115 | plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Package information | 2022-05-27 |
MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
Support
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Models
File name | Title | Type | Date |
---|---|---|---|
aup1t98 | aup1t98 IBIS model | IBIS model | 2014-12-21 |
Ordering, pricing & availability
Sample
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