74LVC1G332
Parametrics
Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|---|
74LVC1G332GM | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 2.6 | 150 | 1 | low | -40~125 | 317 | 8 | 161 | XSON6 |
74LVC1G332GN | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 2.6 | 150 | 1 | low | -40~125 | 351 | 26 | 218 | XSON6 |
74LVC1G332GS | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 2.6 | 150 | 1 | low | -40~125 | XSON6 | |||
74LVC1G332GV | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 2.6 | 150 | 1 | low | -40~125 | 261 | 63 | 172 | TSOP6 |
74LVC1G332GW | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 2.6 | 150 | 1 | low | -40~125 | 284 | 56.2 | 172 | TSSOP6 |
74LVC1G332GX | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 2.6 | 150 | 1 | low | -40~125 | X2SON6 |
Package
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
74LVC1G332GM | 74LVC1G332GM,115 (935282686115) |
Active | YG |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_115 |
74LVC1G332GM,132 (935282686132) |
Active | YG | SOT886_132 | ||||
74LVC1G332GN | 74LVC1G332GN,132 (935291784132) |
Active | YG |
XSON6 (SOT1115) |
SOT1115 |
REFLOW_BG-BD-1
|
SOT1115_132 |
74LVC1G332GS | 74LVC1G332GS,132 (935292911132) |
Active | YG |
XSON6 (SOT1202) |
SOT1202 |
REFLOW_BG-BD-1
|
SOT1202_132 |
74LVC1G332GV | 74LVC1G332GV,125 (935282687125) |
Active | YG |
TSOP6 (SOT457) |
SOT457 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT457_125 |
74LVC1G332GW | 74LVC1G332GW,125 (935282688125) |
Active | YG |
TSSOP6 (SOT363-2) |
SOT363-2 | SOT363-2_125 | |
74LVC1G332GX | 74LVC1G332GXZ (935307075147) |
Active | YG |
X2SON6 (SOT1255-2) |
SOT1255-2 | SOT1255-2_147 |
All type numbers in the table below are discontinued.
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
74LVC1G332GF | 74LVC1G332GF,132 (935282689132) |
Obsolete | YG |
XSON6 (SOT891) |
SOT891 |
REFLOW_BG-BD-1
|
SOT891_132 |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
74LVC1G332GM | 74LVC1G332GM,115 | 74LVC1G332GM | ||
74LVC1G332GM | 74LVC1G332GM,132 | 74LVC1G332GM | ||
74LVC1G332GN | 74LVC1G332GN,132 | 74LVC1G332GN | ||
74LVC1G332GS | 74LVC1G332GS,132 | 74LVC1G332GS | ||
74LVC1G332GV | 74LVC1G332GV,125 | 74LVC1G332GV | ||
74LVC1G332GW | 74LVC1G332GW,125 | 74LVC1G332GW | ||
74LVC1G332GX | 74LVC1G332GXZ | 74LVC1G332GX |
All type numbers in the table below are discontinued.
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
74LVC1G332GF | 74LVC1G332GF,132 | 74LVC1G332GF |
Documentation (36)
File name | Title | Type | Date |
---|---|---|---|
74LVC1G332 | Single 3-input OR gate | Data sheet | 2023-08-18 |
AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
001aad933 | Block diagram: 74AUP1G332GF, 74AUP1G332GM, 74AUP1G332GW, 74LVC1G332GF, 74LVC1G332GM, 74LVC1G332GV, 74LVC1G332GW | Block diagram | 2009-11-03 |
Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
SOT891 | 3D model for products with SOT891 package | Design support | 2019-10-03 |
SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
SOT1115 | 3D model for products with SOT1115 package | Design support | 2023-02-02 |
SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
SOT457 | 3D model for products with SOT457 package | Design support | 2022-11-04 |
SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
SOT1255-2 | 3D model for products with SOT1255-2 package | Design support | 2021-01-28 |
lvc1g332 | 74LVC1G332 IBIS model | IBIS model | 2015-09-06 |
Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DFN1010-6_SOT891_mk | plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 1 mm x 1 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
XSON6_SOT1115_mk | plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Marcom graphics | 2017-01-28 |
TSOP6_SOT457_mk | plastic, surface-mounted package (TSOP6); 6 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body | Marcom graphics | 2017-01-28 |
SOT891 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1 mm x 0.5 mm body | Package information | 2020-04-21 |
SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
SOT1115 | plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Package information | 2022-05-27 |
SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
SOT457 | plastic, surface-mounted package (SC-74; TSOP6); 6 leads | Package information | 2023-03-03 |
SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
SOT1255-2 | plastic thermal enhanced extremely thin small outline package; no leads;6 terminals; body 1.0 x 0.8 x 0.32 mm | Package information | 2020-08-27 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
MAR_SOT891 | MAR_SOT891 Topmark | Top marking | 2013-06-03 |
MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
MAR_SOT1115 | MAR_SOT1115 Topmark | Top marking | 2013-06-03 |
MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
MAR_SOT457 | MAR_SOT457 Topmark | Top marking | 2013-06-03 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
Support
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Models
File name | Title | Type | Date |
---|---|---|---|
SOT891 | 3D model for products with SOT891 package | Design support | 2019-10-03 |
SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
SOT1115 | 3D model for products with SOT1115 package | Design support | 2023-02-02 |
SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
SOT457 | 3D model for products with SOT457 package | Design support | 2022-11-04 |
SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
SOT1255-2 | 3D model for products with SOT1255-2 package | Design support | 2021-01-28 |
lvc1g332 | 74LVC1G332 IBIS model | IBIS model | 2015-09-06 |
Ordering, pricing & availability
Sample
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