Parametrics
Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|---|
74LVC2G34GM-Q100 | Production | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 175 | 2 | low | -40~125 | 290 | 6.5 | 145 | XSON6 |
74LVC2G34GV-Q100 | Production | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 175 | 2 | low | -40~125 | 231 | 39.1 | 145 | TSOP6 |
74LVC2G34GW-Q100 | Production | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 175 | 2 | low | -40~125 | 264 | 38.4 | 153 | TSSOP6 |
Package
Type number | Package | Package information | Reflow-/Wave soldering | Packing | Status | Marking | Orderable part number, (Ordering code (12NC)) |
---|---|---|---|---|---|---|---|
74LVC2G34GM-Q100 | XSON6 (SOT886) | SOT886 | REFLOW_BG-BD-1 | SOT886_125 | Active | YA | 74LVC2G34GM-Q100,1 ( 9352 990 49125 ) |
74LVC2G34GV-Q100 | TSOP6 (SOT457) | SOT457 | REFLOW_BG-BD-1 WAVE_BG-BD-1 | SOT457_125 | Active | Y34 | 74LVC2G34GV-Q100,1 ( 9352 990 51125 ) |
74LVC2G34GW-Q100 | TSSOP6 (SOT363-2) | SOT363-2 | SOT363-2_125 | Active | YA | 74LVC2G34GW-Q100,1 ( 9352 990 52125 ) |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator | Leadfree conversion date |
---|---|---|---|---|---|
74LVC2G34GM-Q100 | 74LVC2G34GM-Q100,1 | 74LVC2G34GM-Q100 | Always Pb-free | ||
74LVC2G34GV-Q100 | 74LVC2G34GV-Q100,1 | 74LVC2G34GV-Q100 | Always Pb-free | ||
74LVC2G34GW-Q100 | 74LVC2G34GW-Q100,1 | 74LVC2G34GW-Q100 | Always Pb-free |
Documentation (11)
File name | Title | Type | Date |
---|---|---|---|
lvc2g34 | 74LVC2G34 IBIS model | IBIS model | 2015-09-06 |
Nexperia_document_leaflet_Logic_Automotive_MicroPak_solutions_201904 | Automotive logic in MicroPak leadless packages | Leaflet | 2019-04-18 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT457 | MAR_SOT457 Topmark | Top marking | 2013-06-03 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SOT457 | plastic, surface-mounted package (SC-74; TSOP6); 6 leads | Package information | 2023-03-03 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
Support
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Models
File name | Title | Type | Date |
---|---|---|---|
lvc2g34 | 74LVC2G34 IBIS model | IBIS model | 2015-09-06 |
Ordering, pricing & availability
Sample
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