Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

SOT8073-1

SOT8073-1

flip chip land gid array package; no leads; body: 3.2 x 2.2 x 0.774 mm, 3-pad

Package information

Package information Package name Package description Reference Date
SOT8073-1 FCLGA3 flip chip land gid array package; no leads; body: 3.2 x 2.2 x 0.774 mm, 3-pad MO-303 compatible (JEDEC) 2023-03-13

Related documents

File name Title Type Date
SOT8073-1 flip chip land gid array package; no leads; body: 3.2 x 2.2 x 0.774 mm, 3-pad Package information 2023-03-21
SOT8073-1_328 FCLGA; Reel dry pack for SMD, 7"; Q2/T3 product orientation Packing information 2023-04-18

Products in this package

GaN FETs

Type number Description Quick access
GAN7R0-150LBE 150 V, 7 mOhm Gallium Nitride (GaN) FET in a 2.2 mm x 3.2 mm x 0.774 mm Land Grid Array (LGA) package