Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

OL-IP3319CX6

OL-IP3319CX6

Wafer level chip-size package; 6 bumps (2 x 3); 0.4 mm pitch; 0.95 mm x 1.34 mm x 0.6 mm body

Package information

Package information Package name Package description Reference Date
OL-IP3319CX6 WLCSP6 Wafer level chip-size package; 6 bumps (2 x 3); 0.4 mm pitch; 0.95 mm x 1.34 mm x 0.6 mm body 2013-06-11

Related documents

File name Title Type Date
OL-IP3319CX6 3D model for products with OL-IP3319CX6 package Design support 2023-03-13
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
OL-IP3319CX6 Wafer level chip-size package; 6 bumps (2 x 3); 0.4 mm pitch; 0.95 mm x 1.34 mm x 0.6 mm body Package information 2022-07-13

Products in this package

ESD protection, TVS, filtering and signal conditioning

Type number Description Quick access
IP3319CX6 Single-channel common-mode filter with integrated ESD protection network