Package information
Package information | Package name | Package description | Reference | Date |
---|---|---|---|---|
WLCSP6 | wafer level chip-scale package, 6 bumps | 2016-03-02 |
Related documents
File name | Title | Type | Date |
---|---|---|---|
Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
Products in this package
Analog & Logic ICs
Type number | Description | Quick access |
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