74LVC244A-Q100; 74LVCH244A-Q100
Octal buffer/line driver; 3-state
The 74LVC244A-Q100; 74LVCH244A-Q100 is an octal non-inverting buffer/line driver with 3-state outputs. The 3-state outputs are controlled by the output enable inputs 1OE and 2OE. A HIGH on nOE causes the outputs to assume a high-impedance OFF-state. Schmitt-trigger action at all inputs makes the circuit highly tolerant for slower input rise and fall times.
Inputs can be driven from either 3.3 V or 5.0 V devices. In 3-state operation, outputs can handle 5 V. These features allow the use of these devices as translators in a mixed 3.3 V and 5 V environment.
The 74LVCH244A-Q100 bus hold on data inputs eliminates the need for external pull-up resistors to hold unused inputs.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
5 V tolerant inputs/outputs for interfacing with 5 V logic
Wide supply voltage range from 1.2 V to 3.6 V
CMOS low-power consumption
Direct interface with TTL levels
Inputs accept voltages up to 5.5 V
High-impedance when VCC = 0 V
Bus hold on all data inputs (74LVCH244A-Q100 only)
Complies with JEDEC standard:
JESD8-7A (1.65 V to 1.95 V)
JESD8-5A (2.3 V to 2.7 V)
JESD8-C/JESD36 (2.7 V to 3.6 V)
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints
Parametrics
| Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|---|
| 74LVC244ABQ-Q100 | 1.2 - 3.6 | CMOS/LVTTL | ± 24 | 175 | 8 | low | -40~125 | DHVQFN20 |
| 74LVC244AD-Q100 | 1.2 - 3.6 | CMOS/LVTTL | ± 24 | 175 | 8 | low | -40~125 | SO20 |
| 74LVC244APW-Q100 | 1.2 - 3.6 | CMOS/LVTTL | ± 24 | 175 | 8 | low | -40~125 | TSSOP20 |
| 74LVCH244ABQ-Q100 | 1.2 - 3.6 | CMOS/LVTTL | ± 24 | 175 | 8 | low | -40~125 | DHVQFN20 |
| 74LVCH244AD-Q100 | 1.2 - 3.6 | CMOS/LVTTL | ± 24 | 175 | 8 | low | -40~125 | SO20 |
| 74LVCH244APW-Q100 | 1.2 - 3.6 | CMOS/LVTTL | ± 24 | 175 | 8 | low | -40~125 | TSSOP20 |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74LVC244ABQ-Q100 | 74LVC244ABQ-Q100X (935299298115) |
Active | LVC244A |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| 74LVC244AD-Q100 | 74LVC244AD-Q100J (935299301118) |
Active | 74LVC244AD |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
| 74LVC244APW-Q100 | 74LVC244APW-Q100J (935299302118) |
Active | LVC244A LVC244A Standard Procedure Standard Procedure |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
| 74LVCH244ABQ-Q100 | 74LVCH244ABQ-Q100X (935299498115) |
Active | LVCH244A |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| 74LVCH244AD-Q100 | 74LVCH244AD-Q100J (935299499118) |
Active | 74LVCH244AD |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
| 74LVCH244APW-Q100 | 74LVCH244APW-Q100J (935299501118) |
Active | VCH244A |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
All type numbers in the table below are discontinued.
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74LVC244ADB-Q100 | 74LVC244ADB-Q100J (935302546118) |
Obsolete | LVC244A |
SSOP20 (SOT339-1) |
SOT339-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT339-1_118 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74LVC244ABQ-Q100 | 74LVC244ABQ-Q100X | 74LVC244ABQ-Q100 |
|
|
| 74LVC244AD-Q100 | 74LVC244AD-Q100J | 74LVC244AD-Q100 |
|
|
| 74LVC244APW-Q100 | 74LVC244APW-Q100J | 74LVC244APW-Q100 |
|
|
| 74LVCH244ABQ-Q100 | 74LVCH244ABQ-Q100X | 74LVCH244ABQ-Q100 |
|
|
| 74LVCH244AD-Q100 | 74LVCH244AD-Q100J | 74LVCH244AD-Q100 |
|
|
| 74LVCH244APW-Q100 | 74LVCH244APW-Q100J | 74LVCH244APW-Q100 |
|
|
All type numbers in the table below are discontinued.
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74LVC244ADB-Q100 | 74LVC244ADB-Q100J | 74LVC244ADB-Q100 |
|
|
Documentation (18)
| File name | Title | Type | Date |
|---|---|---|---|
| 74LVC_LVCH244A_Q100 | Octal buffer/line driver; 3-state | Data sheet | 2023-08-08 |
| AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
| AN263 | Power considerations when using CMOS and BiCMOS logic devices | Application note | 2023-02-07 |
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| lvc244a | lvc244a IBIS model | IBIS model | 2021-02-02 |
| lvch244a | lvch244a IBIS model | IBIS model | 2013-04-09 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN20_SOT764-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
| SOT163-1 | plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body | Package information | 2022-06-20 |
| SOT339-1 | plastic, shrink small outline package; 20 leads; 0.65 mm pitch; 7.2 mm x 5.3 mm x 2 mm body | Package information | 2020-04-21 |
| SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Package information | 2022-06-21 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
Support
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Models
| File name | Title | Type | Date |
|---|---|---|---|
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| lvc244a | lvc244a IBIS model | IBIS model | 2021-02-02 |
| lvch244a | lvch244a IBIS model | IBIS model | 2013-04-09 |
Ordering, pricing & availability
Sample
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