74AHCU04-Q100
Hex unbuffered inverter
The 74AHCU04-Q100 is high-speed Si-gate CMOS device and is pin compatible with low-power Schottky TTL (LSTTL). It is specified in compliance with JEDEC standard No. 7A.
The 74AHCU04-Q100 is a general-purpose hex unbuffered inverter. Each of the six inverters is a single stage.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Low power dissipation
Balanced propagation delays
Inputs accept voltages higher than VCC
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints
Parametrics
| Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|---|
| 74AHCU04BQ-Q100 | 2.0 - 5.5 | CMOS | ± 8 | 60 | 6 | low | -40~125 | DHVQFN14 |
| 74AHCU04D-Q100 | 2.0 - 5.5 | CMOS | ± 8 | 60 | 6 | low | -40~125 | SO14 |
| 74AHCU04PW-Q100 | 2.0 - 5.5 | CMOS | ± 8 | 60 | 6 | low | -40~125 | TSSOP14 |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74AHCU04BQ-Q100 | 74AHCU04BQ-Q100X (935300742115) |
Active | AHU04 |
DHVQFN14 (SOT762-1) |
SOT762-1 | SOT762-1_115 | |
| 74AHCU04D-Q100 | 74AHCU04D-Q100J (935300739118) |
Active | 74AHCU04D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_118 |
| 74AHCU04PW-Q100 | 74AHCU04PW-Q100J (935300741118) |
Active | AHCU04 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74AHCU04BQ-Q100 | 74AHCU04BQ-Q100X | 74AHCU04BQ-Q100 |
|
|
| 74AHCU04D-Q100 | 74AHCU04D-Q100J | 74AHCU04D-Q100 |
|
|
| 74AHCU04PW-Q100 | 74AHCU04PW-Q100J | 74AHCU04PW-Q100 |
|
|
Documentation (17)
| File name | Title | Type | Date |
|---|---|---|---|
| 74AHCU04_Q100 | Hex unbuffered inverter | Data sheet | 2024-01-25 |
| SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| ahcu04 | ahcu04 IBIS model | IBIS model | 2013-04-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN14_SOT762-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; 0.5 mm pitch; 2.5 mm x 3 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| SO14_SOT108-1_mk | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
| TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | Package information | 2023-04-05 |
| SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
Support
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Models
| File name | Title | Type | Date |
|---|---|---|---|
| SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| ahcu04 | ahcu04 IBIS model | IBIS model | 2013-04-08 |
Ordering, pricing & availability
Sample
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