74LVC823A
9-bit D-type flip-flop with 5 V tolerant inputs/outputs; positive edge-trigger; 3-state
The 74LVC823A is a 9-bit D-type flip-flop with common clock (pin CP), clock enable (pin CE), master reset (pin MR) and 3-state outputs (pins Qn) for bus-oriented applications. The 9 flip-flops stores the state of their individual D-inputs that meet the set-up and hold times requirements on the LOW to HIGH CP transition, provided pin CE is LOW. When pin CE is HIGH, the flip-flops hold their data. A LOW on pin MR resets all flip-flops. When pin OE is LOW, the contents of the 9 flip-flops are available at the outputs. When pin OE is HIGH, the outputs go to the high-impedance OFF-state. Operation of the OE input does not affect the state of the flip-flops.
Inputs can be driven from either 3.3 V or 5 V devices. When disabled, up to 5.5 V can be applied to the outputs. These features allow the use of these devices as translators in mixed 3.3 V and 5 V applications.
Features and benefits
- 5 V tolerant inputs/outputs for interfacing with 5 V logic
- Wide supply voltage range from 1.2 V to 3.6 V
- CMOS low power consumption
- Direct interface with TTL levels
- Flow-through pinout architecture
- 9-bit positive edge-triggered register
- Independent register and 3-state buffer operation
- Complies with JEDEC standard:
- JESD8-7A (1.65 V to 1.95 V)
- JESD8-5A (2.3 V to 2.7 V)
- JESD8-C/JESD36 (2.7 V to 3.6 V)
- ESD protection:
- HBM JESD22-A114F exceeds 2000 V
- MM JESD22-A115-B exceeds 200 V
- CDM JESD22-C101E exceeds 1000 V
- Specified from -40 °C to +85 °C and -40 °C to +125 °C.
Parametrics
| Type number |
|---|
Package
All type numbers in the table below are discontinued.
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74LVC823ADB | 74LVC823ADB,112 (935262540112) |
Obsolete | LVC823A Standard Procedure Standard Procedure |
SSOP24 (SOT340-1) |
SOT340-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
Not available |
| 74LVC823ADB,118 (935262540118) |
Obsolete | LVC823A Standard Procedure Standard Procedure | SOT340-1_118 | ||||
| 74LVC823APW | 74LVC823APW,112 (935262541112) |
Obsolete | LVC823A |
TSSOP24 (SOT355-1) |
SOT355-1 |
SSOP-TSSOP-VSO-WAVE
|
Not available |
| 74LVC823APW,118 (935262541118) |
Obsolete | LVC823A | SOT355-1_118 |
Environmental information
All type numbers in the table below are discontinued.
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74LVC823ADB | 74LVC823ADB,112 | 74LVC823ADB |
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| 74LVC823ADB | 74LVC823ADB,118 | 74LVC823ADB |
|
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| 74LVC823APW | 74LVC823APW,112 | 74LVC823APW |
|
|
| 74LVC823APW | 74LVC823APW,118 | 74LVC823APW |
|
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Documentation (13)
| File name | Title | Type | Date |
|---|---|---|---|
| 74LVC823A | 9-bit D-type flip-flop with 5 V tolerant inputs/outputs; positive edge-trigger; 3-state | Data sheet | 2020-06-19 |
| AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
| AN263 | Power considerations when using CMOS and BiCMOS logic devices | Application note | 2023-02-07 |
| 001aaa850 | Block diagram: 74LVC823ABQ, 74LVC823AD, 74LVC823ADB, 74LVC823APW | Block diagram | 2009-11-03 |
| SOT355-1 | 3D model for products with SOT355-1 package | Design support | 2020-01-22 |
| lvc823a | lvc823a IBIS model | IBIS model | 2013-04-09 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SOT340-1 | plastic, shrink small outline package; 24 leads; 0.65 mm pitch; 8.2 mm x 5.3 mm x 2 mm body | Package information | 2020-04-21 |
| SOT355-1 | plastic, thin shrink small outline package; 24 leads; 0.65 mm pitch; 7.8 mm x 4.4 mm x 1.1 mm body | Package information | 2022-06-22 |
| SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| lvc | lvc Spice model | SPICE model | 2013-05-07 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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