NXT4559
SIM card interface level translator
The NXT4559 device is built for interfacing a SIM card with a single low-voltage host side interface. The NXT4559 has three level translators to convert the data, RST and CLK signals between a SIM card and a host microcontroller. A high speed level translation capable of supporting class-B, class-C SIM cards. VCC_SIM power-down initiates a shutdown sequence on SIM card pins in accordance with ISO-7816-3.
The NXT4559 is compliant with all ETSI, IMT-2000 and ISO-7816 SIM/Smart card interface requirements.
Features and benefits
Support SIM cards and eSIM with supply voltages 1.62 V to 3.3 V
Host micro-controller operating voltage range: 1.08 V to 1.98 V
Automatic level translation of I/O, RST and CLK between SIM card and host side interface with capacitance isolation
Incorporates shutdown feature for the SIM card signals according to ISO-7816-3
High Vdis(UVLO_AC) switching level, arranging quick shut down when VCC_SIM powers down
Integrated pull-up resistors; no external resistor required
Integrated EMI Filters suppresses higher harmonics of digital I/O's
Low current shutdown mode < 1 μA
Supports clock speed beyond 5 MHz clock
Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen and antimony (Dark Green compliant)
Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
IEC61000-4-2 level 4, contact and air discharge on all SIM card-side pins exceeds 8 kV and 15 kV
Available in 9-pin wafer level chip-scale package (WLCSP); 9 bumps; 1.06 mm x 1.06 mm x 0.43 mm body; 0.35 mm pitch
Specified from -40 °C to +85 °C
Applications
NXT4559 can be used with a range of SIM card attached devices including:
Mobile and personal phones
Wireless modems
SIM card terminals
Parametrics
Type number | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|---|
NXT4559UP | 1.08 - 1.98 | 1.62 - 3.3 | CMOS | ± 1 | 20 | 3 | low | -40~85 | WLCSP9 |
Package
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
NXT4559UP | NXT4559UPZ (935691709336) |
Active | z9 |
WLCSP9 (SOT8027-1) |
SOT8027-1 | SOT8027-1_336 |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
NXT4559UP | NXT4559UPZ | NXT4559UP |
Documentation (5)
File name | Title | Type | Date |
---|---|---|---|
NXT4559 | SIM card interface level translator | Data sheet | 2024-02-27 |
SOT8027-1 | 3D model for products with SOT8027-1 package | Design support | 2023-02-07 |
nxt4559up | NXT4559UP IBIS model | IBIS model | 2023-12-21 |
SIM_card_NXT4558_NXT4559_leaflet | SIM card interface level translators | Leaflet | 2024-06-28 |
SOT8027-1 | wafer level chip-scale package; 9 bumps; 1.06 mm x 1.06 mm x 0.43 mm body | Package information | 2022-09-27 |
Support
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Ordering, pricing & availability
Sample
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