BC56PA-Q_SER auto medium power
80 V, 1 A NPN medium power transistors
NPN medium power transistor in a SOT1061 (DFN2020-3) leadless very small Surface-Mounted Device (SMD) plastic package.
Features and benefits
High collector current capability IC and ICM
Three current gain selections
High power dissipation capability
Exposed heatsink for excellent thermal and electrical conductivity
Leadless very small SMD plastic package with medium power capability
Qualified according to AEC-Q101 and recommended for use in automotive applications
Applications
Linear voltage regulators
MOSFET drivers
Low-side switches
Power management
Amplifiers
Battery-driven devices
Parametrics
Type number | Package version | Package name | Size (mm) | channel type (e) | Ptot (mW) | VCEO [max] (V) | IC [max] (mA) | hFE [min] | hFE [max] | TJ [max] (°C) | fT [min] (MHz) | Automotive qualified |
---|---|---|---|---|---|---|---|---|---|---|---|---|
BC56-10PA-Q | SOT1061 | DFN2020-3 | 2 x 2 x 0.65 | NPN | 420.0 | 80.0 | 1000.0 | 63.0 | 160.0 | 150 | 100.0 | Y |
BC56-16PA-Q | SOT1061 | DFN2020-3 | 2 x 2 x 0.65 | NPN | 420.0 | 80.0 | 1000.0 | 100.0 | 250.0 | 150 | 100.0 | Y |
BC56PA-Q | SOT1061 | DFN2020-3 | 2 x 2 x 0.65 | NPN | 420.0 | 80.0 | 1000.0 | 63.0 | 250.0 | 150 | 100.0 | Y |
Package
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
BC56-10PA-Q | BC56-10PA-QX (934664529115) |
Active | BK |
DFN2020-3 (SOT1061) |
SOT1061 |
REFLOW_BG-BD-1
|
SOT1061_115 |
BC56-16PA-Q | BC56-16PA-QX (934664521115) |
Active | BL |
DFN2020-3 (SOT1061) |
SOT1061 |
REFLOW_BG-BD-1
|
SOT1061_115 |
BC56PA-Q | BC56PA-QX (934664530115) |
Active | AZ |
DFN2020-3 (SOT1061) |
SOT1061 |
REFLOW_BG-BD-1
|
SOT1061_115 |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
BC56-10PA-Q | BC56-10PA-QX | BC56-10PA-Q | ||
BC56-16PA-Q | BC56-16PA-QX | BC56-16PA-Q | ||
BC56PA-Q | BC56PA-QX | BC56PA-Q |
Documentation (5)
File name | Title | Type | Date |
---|---|---|---|
SOT1061 | 3D model for products with SOT1061 package | Design support | 2022-06-02 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DFN2020-3_SOT1061_mk | plastic, thermal enhanced ultra thin small outline package; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body | Marcom graphics | 2017-01-28 |
SOT1061 | plastic, leadless thermal enhanced ultra thin small outline package; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body | Package information | 2022-05-27 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
Support
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Models
File name | Title | Type | Date |
---|---|---|---|
SOT1061 | 3D model for products with SOT1061 package | Design support | 2022-06-02 |
Ordering, pricing & availability
Sample
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