74LVT04-Q100
3.3 V Hex inverter
The 74LVT04-Q100 is a hex inverter. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 3) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 3)
Specified from -40 °C to +85 °C
Wide supply voltage range from 2.7 to 3.6 V
Overvoltage tolerant inputs to 5.5 V
BiCMOS high speed and output drive
Direct interface with TTL levels
No bus current loading when output is tied to 5 V bus
Power-up 3-state
IOFF circuitry provides partial Power-down mode operation
Latch-up performance exceeds 500 mA per JESD 78 Class II Level B
Complies with JEDEC standards:
JESD8C (2.7 V to 3.6 V)
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Parametrics
Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|
74LVT04D-Q100 | 2.7 - 3.6 | TTL | -0.625 | 150 | 6 | medium | -40~85 | SO14 |
74LVT04PW-Q100 | 2.7 - 3.6 | TTL | -0.625 | 150 | 6 | medium | -40~85 | TSSOP14 |
Package
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
74LVT04D-Q100 | 74LVT04D-Q100J (935300467118) |
Active | 74LVT04D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_118 |
74LVT04PW-Q100 | 74LVT04PW-Q100J (935300468118) |
Active | LVT04 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
All type numbers in the table below are discontinued.
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
74LVT04DB-Q100 | 74LVT04DB-Q100J (935300466118) |
Obsolete | LVT04 |
SSOP14 (SOT337-1) |
SOT337-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
SOT337-1_118 |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
74LVT04D-Q100 | 74LVT04D-Q100J | 74LVT04D-Q100 | ||
74LVT04PW-Q100 | 74LVT04PW-Q100J | 74LVT04PW-Q100 |
All type numbers in the table below are discontinued.
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
74LVT04DB-Q100 | 74LVT04DB-Q100J | 74LVT04DB-Q100 |
Documentation (18)
File name | Title | Type | Date |
---|---|---|---|
74LVT04_Q100 | 3.3 V Hex inverter | Data sheet | 2024-04-18 |
SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
lvt04 | lvt04 IBIS model | IBIS model | 2013-04-09 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
SO14_SOT108-1_mk | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
SSOP14_SOT337-1_mk | plastic, shrink small outline package; 14 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Marcom graphics | 2017-01-28 |
TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
SOT337-1 | plastic, shrink small outline package; 14 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Package information | 2020-04-21 |
SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
lvt | lvt Spice model | SPICE model | 2013-05-07 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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