74AHC30-Q100; 74AHCT30-Q100
8-input NAND gate
The 74AHC30-Q100; 74AHCT30-Q100 is a high-speed Si-gate CMOS device and is pin compatible with Low-power Schottky TTL (LSTTL). It is specified in compliance with JEDEC standard No. 7-A.
The 74AHC30-Q100; 74AHCT30-Q100 provides an 8-input NAND function.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Balanced propagation delays
All inputs have Schmitt-trigger actions
Inputs accept voltages higher than VCC
Input levels:
For 74AHC30-Q100: CMOS level
For 74AHCT30-Q100: TTL level
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints
Parametrics
| Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|---|---|
| 74AHC30BQ-Q100 | 2.0 - 5.5 | CMOS | ± 8 | 3.6 | 60 | 1 | low | -40~125 | DHVQFN14 |
| 74AHC30D-Q100 | 2.0 - 5.5 | CMOS | ± 8 | 3.6 | 60 | 1 | low | -40~125 | SO14 |
| 74AHC30PW-Q100 | 2.0 - 5.5 | CMOS | ± 8 | 3.6 | 60 | 1 | low | -40~125 | TSSOP14 |
| 74AHCT30BQ-Q100 | 4.5 - 5.5 | TTL | ± 8 | 3.3 | 60 | 1 | low | -40~125 | DHVQFN14 |
| 74AHCT30D-Q100 | 4.5 - 5.5 | TTL | ± 8 | 3.3 | 60 | 1 | low | -40~125 | SO14 |
| 74AHCT30PW-Q100 | 4.5 - 5.5 | TTL | ± 8 | 3.3 | 60 | 1 | low | -40~125 | TSSOP14 |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74AHC30BQ-Q100 | 74AHC30BQ-Q100X (935303187115) |
Active | AHC30 |
DHVQFN14 (SOT762-1) |
SOT762-1 | SOT762-1_115 | |
| 74AHC30D-Q100 | 74AHC30D-Q100J (935301389118) |
Active | 74AHC30D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_118 |
| 74AHC30PW-Q100 | 74AHC30PW-Q100J (935303186118) |
Active | AHC30 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
| 74AHCT30BQ-Q100 | 74AHCT30BQ-Q100X (935301385115) |
Active | AHT30 |
DHVQFN14 (SOT762-1) |
SOT762-1 | SOT762-1_115 | |
| 74AHCT30D-Q100 | 74AHCT30D-Q100J (935301207118) |
Active | 74AHCT30D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_118 |
| 74AHCT30PW-Q100 | 74AHCT30PW-Q100J (935301386118) |
Active | AHCT30 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74AHC30BQ-Q100 | 74AHC30BQ-Q100X | 74AHC30BQ-Q100 |
|
|
| 74AHC30D-Q100 | 74AHC30D-Q100J | 74AHC30D-Q100 |
|
|
| 74AHC30PW-Q100 | 74AHC30PW-Q100J | 74AHC30PW-Q100 |
|
|
| 74AHCT30BQ-Q100 | 74AHCT30BQ-Q100X | 74AHCT30BQ-Q100 |
|
|
| 74AHCT30D-Q100 | 74AHCT30D-Q100J | 74AHCT30D-Q100 |
|
|
| 74AHCT30PW-Q100 | 74AHCT30PW-Q100J | 74AHCT30PW-Q100 |
|
|
Documentation (18)
| File name | Title | Type | Date |
|---|---|---|---|
| 74AHC_AHCT30_Q100 | 8-input NAND gate | Data sheet | 2024-03-07 |
| mna490 | Block diagram: 74AHC30BQ, 74AHC30D, 74AHC30PW, 74AHCT30BQ, 74AHCT30D, 74AHCT30PW | Block diagram | 2009-11-03 |
| SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| ahc30 | 74AHC30 IBIS model | IBIS model | 2015-08-30 |
| ahct30 | 74AHCT30 IBIS model | IBIS model | 2015-08-30 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN14_SOT762-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; 0.5 mm pitch; 2.5 mm x 3 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| SO14_SOT108-1_mk | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
| TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | Package information | 2023-04-05 |
| SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
Support
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Models
| File name | Title | Type | Date |
|---|---|---|---|
| SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| ahc30 | 74AHC30 IBIS model | IBIS model | 2015-08-30 |
| ahct30 | 74AHCT30 IBIS model | IBIS model | 2015-08-30 |
Ordering, pricing & availability
Sample
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