74LVC4066-Q100
Quad bilateral switch
The 74LVC4066-Q100 is a high-speed Si-gate CMOS device.
The 74LVC4066-Q100 provides four single pole, single-throw analog switch functions. Each switch has two input/output terminals (nY and nZ) and an active HIGH enable input (nE). When nE is LOW, the analog switch is turned off.
Schmitt-trigger action at the enable inputs makes the circuit tolerant of slower input rise and fall times across the entire VCC range from 1.65 V to 5.5 V.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Wide supply voltage range from 1.65 V to 5.5 V
Very low ON resistance:
7.5 Ω (typical) at VCC = 2.7 V
6.5 Ω (typical) at VCC = 3.3 V
6 Ω (typical) at VCC = 5 V
Switch current capability of 32 mA
High noise immunity
CMOS low-power consumption
Direct interface TTL-levels
Latch-up performance exceeds 250 mA
Enable inputs accept voltages up to 5 V
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints
Parametrics
| Type number | Configuration | VCC (V) | RON (Ω) | Logic switching levels | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|
| 74LVC4066BQ-Q100 | SPST-NO | 1.65 - 5.5 | 15 | CMOS/LVTTL | very low | -40~125 | DHVQFN14 |
| 74LVC4066D-Q100 | SPST-NO | 1.65 - 5.5 | 15 | CMOS/LVTTL | very low | -40~125 | SO14 |
| 74LVC4066PW-Q100 | SPST-NO | 1.65 - 5.5 | 15 | CMOS/LVTTL | very low | -40~125 | TSSOP14 |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74LVC4066BQ-Q100 | 74LVC4066BQ-Q100X (935299339115) |
Active | C4066 |
DHVQFN14 (SOT762-1) |
SOT762-1 | SOT762-1_115 | |
| 74LVC4066D-Q100 | 74LVC4066D-Q100J (935299341118) |
Active | 74LVC4066D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_118 |
| 74LVC4066PW-Q100 | 74LVC4066PW-Q100J (935299342118) |
Active | LVC4066 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74LVC4066BQ-Q100 | 74LVC4066BQ-Q100X | 74LVC4066BQ-Q100 |
|
|
| 74LVC4066D-Q100 | 74LVC4066D-Q100J | 74LVC4066D-Q100 |
|
|
| 74LVC4066PW-Q100 | 74LVC4066PW-Q100J | 74LVC4066PW-Q100 |
|
|
Documentation (19)
| File name | Title | Type | Date |
|---|---|---|---|
| 74LVC4066_Q100 | Quad bilateral switch | Data sheet | 2024-02-22 |
| AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
| AN263 | Power considerations when using CMOS and BiCMOS logic devices | Application note | 2023-02-07 |
| SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| lvc4066 | LVC4066 IBIS model | IBIS model | 2020-05-14 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN14_SOT762-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; 0.5 mm pitch; 2.5 mm x 3 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| SO14_SOT108-1_mk | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
| TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | Package information | 2023-04-05 |
| SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
Support
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Models
| File name | Title | Type | Date |
|---|---|---|---|
| SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| lvc4066 | LVC4066 IBIS model | IBIS model | 2020-05-14 |
Ordering, pricing & availability
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