74LV14
Hex inverting Schmitt trigger
The 74LV14 is a low-voltage Si-gate CMOS device that is pin and function compatible with 74HC14 and 74HCT14.
The 74LV14 provides six inverting buffers with Schmitt-trigger input. It is capable of transforming slowly-changing input signals into sharply defined, jitter-free output signals.
The inputs switch at different points for positive and negative-going signals. The difference between the positive voltage VT+ and the negative voltage VT- is defined as the input hysteresis voltage VH.
Features and benefits
Wide supply voltage range from 1.0 V to 5.5 V
CMOS low power dissipation
Optimized for low voltage applications: 1.0 V to 3.6 V
Accepts TTL input levels between VCC = 2.7 V and VCC = 3.6 V
Typical output ground bounce < 0.8 V at VCC = 3.3 V and Tamb = 25 °C
Typical HIGH-level output voltage (VOH) undershoot: > 2 V at VCC = 3.3 V and Tamb = 25 °C
- Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
- Complies with JEDEC standards:
- JESD8-7 (1.65 V to 1.95 V)
- JESD8-5 (2.3 V to 2.7 V)
- JESD8C (2.7 V to 3.6 V)
- JESD36 (4.5 V to 5.5 V)
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Applications
Wave and pulse shapers for highly noisy environments
Astable multivibrators
Monostable multivibrators
Parametrics
| Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|---|
| 74LV14BQ | 1.0 - 5.5 | TTL | ± 12 | 30 | 6 | low | -40~125 | DHVQFN14 |
| 74LV14D | 1.0 - 5.5 | TTL | ± 12 | 30 | 6 | low | -40~125 | SO14 |
| 74LV14PW | 1.0 - 5.5 | TTL | ± 12 | 30 | 6 | low | -40~125 | TSSOP14 |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74LV14BQ | 74LV14BQ,115 (935285557115) |
Active | LV14 |
DHVQFN14 (SOT762-1) |
SOT762-1 | SOT762-1_115 | |
| 74LV14D | 74LV14D,118 (935069490118) |
Active | 74LV14D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_118 |
| 74LV14PW | 74LV14PW,118 (935175230118) |
Active | LV14 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
All type numbers in the table below are discontinued.
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74LV14DB | 74LV14DB,112 (935170180112) |
Obsolete | LV14 |
SSOP14 (SOT337-1) |
SOT337-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
Not available |
| 74LV14DB,118 (935170180118) |
Discontinued / End-of-life | LV14 | SOT337-1_118 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74LV14BQ | 74LV14BQ,115 | 74LV14BQ |
|
|
| 74LV14D | 74LV14D,118 | 74LV14D |
|
|
| 74LV14PW | 74LV14PW,118 | 74LV14PW |
|
|
All type numbers in the table below are discontinued.
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74LV14DB | 74LV14DB,112 | 74LV14DB |
|
|
| 74LV14DB | 74LV14DB,118 | 74LV14DB |
|
|
Documentation (20)
| File name | Title | Type | Date |
|---|---|---|---|
| 74LV14 | Hex inverting Schmitt trigger | Data sheet | 2024-01-23 |
| SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| lv14 | 74LV14 IBIS model | IBIS model | 2019-01-09 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN14_SOT762-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; 0.5 mm pitch; 2.5 mm x 3 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| SO14_SOT108-1_mk | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
| SSOP14_SOT337-1_mk | plastic, shrink small outline package; 14 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Marcom graphics | 2017-01-28 |
| TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | Package information | 2023-04-05 |
| SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT337-1 | plastic, shrink small outline package; 14 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Package information | 2020-04-21 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
Support
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Models
| File name | Title | Type | Date |
|---|---|---|---|
| SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| lv14 | 74LV14 IBIS model | IBIS model | 2019-01-09 |
Sample
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