Bipolar transistors

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ESD protection, TVS, filtering and signal conditioning

MOSFETs

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Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

74LVC2G14-Q100

Dual inverting Schmitt trigger with 5 V tolerant input

The 74LVC2G14-Q100 is a dual inverter with Schmitt-trigger inputs. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments.

This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

Features and benefits

  • Automotive product qualification in accordance with AEC-Q100 (Grade 1)

    • Specified from -40 °C to +85 °C and from -40 °C to +125 °C

  • Wide supply voltage range from 1.65 V to 5.5 V

  • High noise immunity

  • ±24 mA output drive (VCC = 3.0 V)

  • CMOS low power dissipation

  • Direct interface with TTL levels

  • Unlimited rise and fall times

  • Overvoltage tolerant inputs to 5.5 V

  • IOFF circuitry provides partial Power-down mode operation

  • Latch-up performance exceeds 250 mA

  • Complies with JEDEC standard:

    • JESD8-7 (1.65 V to 1.95 V)

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8C (2.7 V to 3.6 V)

    • JESD36 (4.5 V to 5.5 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

Applications

  • Wave and pulse shaper

  • Astable multivibrator

  • Monostable multivibrator

Parametrics

Type number VCC (V) Logic switching levels Output drive capability (mA) fmax (MHz) Nr of bits Power dissipation considerations Tamb (°C) Package name
74LVC2G14GM-Q100 1.65 - 5.5 CMOS/LVTTL ± 32 175 2 low -40~125 XSON6
74LVC2G14GV-Q100 1.65 - 5.5 CMOS/LVTTL ± 32 175 2 low -40~125 TSOP6
74LVC2G14GW-Q100 1.65 - 5.5 CMOS/LVTTL ± 32 175 2 low -40~125 TSSOP6

Package

Type number Orderable part number, (Ordering code (12NC)) Status Marking Package Package information Reflow-/Wave soldering Packing
74LVC2G14GM-Q100 74LVC2G14GM-Q100X
(935690714115)		 Active VK SOT886
XSON6
(SOT886) 		SOT886 REFLOW_BG-BD-1
SOT886_115
74LVC2G14GV-Q100 74LVC2G14GV-Q100H
(935301404125)		 Active V14 SOT457
TSOP6
(SOT457) 		SOT457 REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT457_125
74LVC2G14GW-Q100 74LVC2G14GW-Q100H
(935301405125)		 Active VK SOT363-2
TSSOP6
(SOT363-2) 		SOT363-2 SOT363-2_125

Environmental information

Type number Orderable part number Chemical content RoHS RHF-indicator
74LVC2G14GM-Q100 74LVC2G14GM-Q100X 74LVC2G14GM-Q100 rohs rhf rhf
74LVC2G14GV-Q100 74LVC2G14GV-Q100H 74LVC2G14GV-Q100 rohs rhf rhf
74LVC2G14GW-Q100 74LVC2G14GW-Q100H 74LVC2G14GW-Q100 rohs rhf rhf
Quality and reliability disclaimer

Documentation (18)

File name Title Type Date
74LVC2G14_Q100 Dual inverting Schmitt trigger with 5 V tolerant input Data sheet 2023-08-18
Nexperia_document_guide_MiniLogic_MicroPak_201808 MicroPak leadless logic portfolio guide Brochure 2018-09-03
Nexperia_document_guide_MiniLogic_PicoGate_201901 PicoGate leaded logic portfolio guide Brochure 2019-01-07
SOT886 3D model for products with SOT886 package Design support 2019-10-03
SOT457 3D model for products with SOT457 package Design support 2022-11-04
SOT363-2 3D model for products with SOT363-2 package Design support 2023-02-02
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DFN1410-6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
XSON6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
TSOP6_SOT457_mk plastic, surface-mounted package (TSOP6); 6 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body Marcom graphics 2017-01-28
SOT886 plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Package information 2022-06-01
SOT457 plastic, surface-mounted package (SC-74; TSOP6); 6 leads Package information 2023-03-03
SOT363-2 plastic thin shrink small outline package; 6 leads; body width 1.25 mm Package information 2022-11-21
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
Nexperia_Selection_guide_2023 Nexperia Selection Guide 2023 Selection guide 2023-05-10
MAR_SOT886 MAR_SOT886 Topmark Top marking 2013-06-03
MAR_SOT457 MAR_SOT457 Topmark Top marking 2013-06-03
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08

Support

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Models

File name Title Type Date
SOT886 3D model for products with SOT886 package Design support 2019-10-03
SOT457 3D model for products with SOT457 package Design support 2022-11-04
SOT363-2 3D model for products with SOT363-2 package Design support 2023-02-02

Ordering, pricing & availability

Sample

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