74HC74; 74HCT74
Dual D-type flip-flop with set and reset; positive edge-trigger
The 74HC74 and 74HCT74 are dual positive edge triggered D-type flip-flop. They have individual data (nD), clock (nCP), set (nSD) and reset (nRD) inputs, and complementary nQ and nQ outputs. Data at the nD-input, that meets the set-up and hold time requirements on the LOW-to-HIGH clock transition, is stored in the flip-flop and appears at the nQ output. Schmitt-trigger action in the clock input, makes the circuit highly tolerant to slower clock rise and fall times. Inputs include clamp diodes that enable the use of current limiting resistors to interface inputs to voltages in excess of VCC.
Features and benefits
- Wide supply voltage range from 2.0 to 6.0 V
- CMOS low power dissipation
- High noise immunity
Input levels:
For 74HC74: CMOS level
For 74HCT74: TTL level
Symmetrical output impedance
High noise immunity
Balanced propagation delays
- Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
-
Complies with JEDEC standards:
- JESD8C (2.7 V to 3.6 V)
- JESD7A (2.0 V to 6.0 V)
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Parametrics
| Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|---|
| 74HC74BQ | 2.0 - 6.0 | CMOS | ± 5.2 | 14 | 82 | low | -40~125 | DHVQFN14 |
| 74HC74D | 2.0 - 6.0 | CMOS | ± 5.2 | 14 | 82 | low | -40~125 | SO14 |
| 74HC74PW | 2.0 - 6.0 | CMOS | ± 5.2 | 14 | 82 | low | -40~125 | TSSOP14 |
| 74HCT74BQ | 4.5 - 5.5 | TTL | ± 4 | 15 | 59 | low | -40~125 | DHVQFN14 |
| 74HCT74D | 4.5 - 5.5 | TTL | ± 4 | 15 | 59 | low | -40~125 | SO14 |
| 74HCT74PW | 4.5 - 5.5 | TTL | ± 4 | 15 | 59 | low | -40~125 | TSSOP14 |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74HC74BQ | 74HC74BQ,115 (935273672115) |
Active | HC74 |
DHVQFN14 (SOT762-1) |
SOT762-1 | SOT762-1_115 | |
| 74HC74D | 74HC74D,653 (933713380653) |
Active | 74HC74D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
Not available |
| 74HC74PW | 74HC74PW,118 (935175130118) |
Active | HC74 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
| 74HCT74BQ | 74HCT74BQ,115 (935273615115) |
Active | HCT74 |
DHVQFN14 (SOT762-1) |
SOT762-1 | SOT762-1_115 | |
| 74HCT74D | 74HCT74D,653 (933713390653) |
Active | 74HCT74D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
Not available |
| 74HCT74PW | 74HCT74PW,118 (935175150118) |
Active | HCT74 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
All type numbers in the table below are discontinued.
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74HC74D | 74HC74D,652 (933713380652) |
Withdrawn / End-of-life | 74HC74D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_652 |
| 74HCT74D | 74HCT74D,652 (933713390652) |
Withdrawn / End-of-life | 74HCT74D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_652 |
| 74HCT74DB | 74HCT74DB,112 (935175180112) |
Obsolete | HCT74 |
SSOP14 (SOT337-1) |
SOT337-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
Not available |
| 74HCT74DB,118 (935175180118) |
Obsolete | HCT74 | SOT337-1_118 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74HC74BQ | 74HC74BQ,115 | 74HC74BQ |
|
|
| 74HC74D | 74HC74D,653 | 74HC74D |
|
|
| 74HC74PW | 74HC74PW,118 | 74HC74PW |
|
|
| 74HCT74BQ | 74HCT74BQ,115 | 74HCT74BQ |
|
|
| 74HCT74D | 74HCT74D,653 | 74HCT74D |
|
|
| 74HCT74PW | 74HCT74PW,118 | 74HCT74PW |
|
|
All type numbers in the table below are discontinued.
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74HC74D | 74HC74D,652 | 74HC74D |
|
|
| 74HCT74D | 74HCT74D,652 | 74HCT74D |
|
|
| 74HCT74DB | 74HCT74DB,112 | 74HCT74DB |
|
|
| 74HCT74DB | 74HCT74DB,118 | 74HCT74DB |
|
|
Documentation (23)
| File name | Title | Type | Date |
|---|---|---|---|
| 74HC_HCT74 | Dual D-type flip-flop with set and reset; positive edge-trigger | Data sheet | 2024-04-02 |
| AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
| SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| hc74 | 74HC74 IBIS model | IBIS model | 2022-10-21 |
| hct74 | 74HCT74 IBIS model | IBIS model | 2022-10-21 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN14_SOT762-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; 0.5 mm pitch; 2.5 mm x 3 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| SO14_SOT108-1_mk | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
| TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SSOP14_SOT337-1_mk | plastic, shrink small outline package; 14 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Marcom graphics | 2017-01-28 |
| SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | Package information | 2023-04-05 |
| SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| SOT337-1 | plastic, shrink small outline package; 14 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Package information | 2020-04-21 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| hc | HC/HCT Spice model | SPICE model | 2022-02-17 |
| HCT_USER_GUIDE | HC/T User Guide | User manual | 1997-10-31 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
Support
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Models
| File name | Title | Type | Date |
|---|---|---|---|
| SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| hc74 | 74HC74 IBIS model | IBIS model | 2022-10-21 |
| hct74 | 74HCT74 IBIS model | IBIS model | 2022-10-21 |
| hc | HC/HCT Spice model | SPICE model | 2022-02-17 |
Sample
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