74LVC1G57-Q100
Low-power configurable multiple function gate
The 74LVC1G57-Q100 is a configurable multiple function gate with Schmitt-trigger inputs. The device can be configured as any of the following logic functions AND, OR, NAND, NOR, XNOR, inverter and buffer; using the 3-bit input. All inputs can be connected directly to VCC or GND. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments.
This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Wide supply voltage range from 1.65 V to 5.5 V
Overvoltage tolerant inputs to 5.5 V
High noise immunity
±24 mA output drive (VCC = 3.0 V)
CMOS low power dissipation
Latch-up performance exceeds 250 mA
Direct interface with TTL levels
IOFF circuitry provides partial Power-down mode operation
Complies with JEDEC standard:
JESD8-7 (1.65 V to 1.95 V)
JESD8-5 (2.3 V to 2.7 V)
JESD8B/JESD36 (2.7 V to 3.6 V).
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Parametrics
Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|---|
74LVC1G57GV-Q100 | 1.65 - 5.5 | TTL | ± 32 | 6.3 | 150 | 1 | low | -40~125 | TSOP6 |
74LVC1G57GW-Q100 | 1.65 - 5.5 | TTL | ± 32 | 6.3 | 150 | 1 | low | -40~125 | TSSOP6 |
Package
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
74LVC1G57GV-Q100 | 74LVC1G57GV-Q100H (935302838125) |
Active | V57 |
TSOP6 (SOT457) |
SOT457 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT457_125 |
74LVC1G57GW-Q100 | 74LVC1G57GW-Q100H (935302839125) |
Active | YC |
TSSOP6 (SOT363-2) |
SOT363-2 | SOT363-2_125 |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
74LVC1G57GV-Q100 | 74LVC1G57GV-Q100H | 74LVC1G57GV-Q100 | ||
74LVC1G57GW-Q100 | 74LVC1G57GW-Q100H | 74LVC1G57GW-Q100 |
Documentation (16)
File name | Title | Type | Date |
---|---|---|---|
74LVC1G57_Q100 | Low-power configurable multiple function gate | Data sheet | 2023-08-18 |
AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
001aab583 | Block diagram: 74AUP1G57GF, 74AUP1G57GM, 74AUP1G57GW, 74AUP1T57GF, 74AUP1T57GM, 74AUP1T57GW, 74LVC1G57GF, 74LVC1G57GM, 74LVC1G57GV, 74LVC1G57GW | Block diagram | 2009-11-03 |
Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
SOT457 | 3D model for products with SOT457 package | Design support | 2022-11-04 |
SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
lvc1g57 | 74LVC1G57 IBIS model | IBIS model | 2014-10-20 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
TSOP6_SOT457_mk | plastic, surface-mounted package (TSOP6); 6 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body | Marcom graphics | 2017-01-28 |
SOT457 | plastic, surface-mounted package (SC-74; TSOP6); 6 leads | Package information | 2023-03-03 |
SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
MAR_SOT457 | MAR_SOT457 Topmark | Top marking | 2013-06-03 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
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