74HC132-Q100; 74HCT132-Q100
Quad 2-input NAND Schmitt trigger
The 74HC132-Q100; 74HCT132-Q100 is a quad 2-input NAND gate with Schmitt-trigger inputs. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC. Schmitt trigger inputs transform slowly changing input signals into sharply defined jitter-free output signals.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Wide supply voltage range from 2.0 to 6.0 V
CMOS low power dissipation
High noise immunity
Unlimited input rise and fall times
Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
Complies with JEDEC standards:
JESD8C (2.7 V to 3.6 V)
JESD7A (2.0 V to 6.0 V)
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints
Applications
Wave and pulse shapers
Astable multivibrators
Monostable multivibrators
Parametrics
| Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|---|---|
| 74HC132BQ-Q100 | 2.0 - 6.0 | CMOS | ± 5.2 | 11 | 36 | 4 | low | -40~125 | DHVQFN14 |
| 74HC132D-Q100 | 2.0 - 6.0 | CMOS | ± 5.2 | 11 | 36 | 4 | low | -40~125 | SO14 |
| 74HC132PW-Q100 | 2.0 - 6.0 | CMOS | ± 5.2 | 11 | 36 | 4 | low | -40~125 | TSSOP14 |
| 74HCT132D-Q100 | 4.5 - 5.5 | TTL | ± 4 | 17 | 36 | 4 | low | -40~125 | SO14 |
| 74HCT132PW-Q100 | 4.5 - 5.5 | TTL | ± 4 | 17 | 36 | 4 | low | -40~125 | TSSOP14 |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74HC132BQ-Q100 | 74HC132BQ-Q100X (935690579115) |
Active | HC132 |
DHVQFN14 (SOT762-1) |
SOT762-1 | SOT762-1_115 | |
| 74HC132D-Q100 | 74HC132D-Q100,118 (935298737118) |
Active | 74HC132D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_118 |
| 74HC132PW-Q100 | 74HC132PW-Q100,118 (935298738118) |
Active | HC132 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
| 74HCT132D-Q100 | 74HCT132D-Q100,118 (935298739118) |
Active | 74HCT132D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_118 |
| 74HCT132PW-Q100 | 74HCT132PW-Q100,11 (935298741118) |
Active | HCT132 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74HC132BQ-Q100 | 74HC132BQ-Q100X | 74HC132BQ-Q100 |
|
|
| 74HC132D-Q100 | 74HC132D-Q100,118 | 74HC132D-Q100 |
|
|
| 74HC132PW-Q100 | 74HC132PW-Q100,118 | 74HC132PW-Q100 |
|
|
| 74HCT132D-Q100 | 74HCT132D-Q100,118 | 74HCT132D-Q100 |
|
|
| 74HCT132PW-Q100 | 74HCT132PW-Q100,11 | 74HCT132PW-Q100 |
|
|
Documentation (15)
| File name | Title | Type | Date |
|---|---|---|---|
| 74HC_HCT132_Q100 | Quad 2-input NAND Schmitt trigger | Data sheet | 2024-03-11 |
| SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN14_SOT762-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; 0.5 mm pitch; 2.5 mm x 3 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| SO14_SOT108-1_mk | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
| TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | Package information | 2023-04-05 |
| SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
Support
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Ordering, pricing & availability
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