74HC30; 74HCT30
8-input NAND gate
The 74HC30; 74HCT30 is an 8-input NAND gate. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC.
Features and benefits
Wide supply voltage range from 2.0 V to 6.0 V
CMOS low power dissipation
High noise immunity
Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
Complies with JEDEC standards:
- JESD8C (2.7 V to 3.6 V)
- JESD7A (2.0 V to 6.0 V)
Input levels:
For 74HC30: CMOS level
For 74HCT30: TTL level
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Parametrics
| Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|---|---|
| 74HC30D | 2.0 - 6.0 | CMOS | ± 5.2 | 12 | 36 | 1 | low | -40~125 | SO14 |
| 74HC30PW | 2.0 - 6.0 | CMOS | ± 5.2 | 12 | 36 | 1 | low | -40~125 | TSSOP14 |
| 74HCT30D | 4.5 - 5.5 | TTL | ± 4 | 12 | 36 | 1 | low | -40~125 | SO14 |
| 74HCT30PW | 4.5 - 5.5 | TTL | ± 4 | 12 | 36 | 1 | low | -40~125 | TSSOP14 |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74HC30D | 74HC30D,653 (933756910653) |
Active | 74HC30D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
Not available |
| 74HC30PW | 74HC30PW,118 (935189030118) |
Active | HC30 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
| 74HCT30D | 74HCT30D,653 (933756930653) |
Active | 74HCT30D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
Not available |
| 74HCT30PW | 74HCT30PW,118 (935189600118) |
Active | HCT30 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
All type numbers in the table below are discontinued.
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74HC30D | 74HC30D,652 (933756910652) |
Withdrawn / End-of-life | 74HC30D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_652 |
| 74HC30DB | 74HC30DB,112 (935188670112) |
Obsolete | HC30 |
SSOP14 (SOT337-1) |
SOT337-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
Not available |
| 74HC30DB,118 (935188670118) |
Obsolete | HC30 | SOT337-1_118 | ||||
| 74HCT30DB | 74HCT30DB,112 (935189310112) |
Obsolete | HCT30 |
SSOP14 (SOT337-1) |
SOT337-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
Not available |
| 74HCT30DB,118 (935189310118) |
Obsolete | HCT30 | SOT337-1_118 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74HC30D | 74HC30D,653 | 74HC30D |
|
|
| 74HC30PW | 74HC30PW,118 | 74HC30PW |
|
|
| 74HCT30D | 74HCT30D,653 | 74HCT30D |
|
|
| 74HCT30PW | 74HCT30PW,118 | 74HCT30PW |
|
|
All type numbers in the table below are discontinued.
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74HC30D | 74HC30D,652 | 74HC30D |
|
|
| 74HC30DB | 74HC30DB,112 | 74HC30DB |
|
|
| 74HC30DB | 74HC30DB,118 | 74HC30DB |
|
|
| 74HCT30DB | 74HCT30DB,112 | 74HCT30DB |
|
|
| 74HCT30DB | 74HCT30DB,118 | 74HCT30DB |
|
|
Documentation (17)
| File name | Title | Type | Date |
|---|---|---|---|
| 74HC_HCT30 | 8-input NAND gate | Data sheet | 2024-03-13 |
| AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SO14_SOT108-1_mk | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
| SSOP14_SOT337-1_mk | plastic, shrink small outline package; 14 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Marcom graphics | 2017-01-28 |
| TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT337-1 | plastic, shrink small outline package; 14 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Package information | 2020-04-21 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| HCT_USER_GUIDE | HC/T User Guide | User manual | 1997-10-31 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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