74LVC1G32
Single 2-input OR gate
The 74LVC1G32 is a single 2-input OR gate. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments. Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.
Features and benefits
Wide supply voltage range from 1.65 V to 5.5 V
Overvoltage tolerant inputs to 5.5 V
High noise immunity
CMOS low power dissipation
IOFF circuitry provides partial Power-down mode operation
±24 mA output drive (VCC = 3.0 V)
Latch-up performance exceeds 250 mA
Direct interface with TTL levels
Complies with JEDEC standard:
JESD8-7 (1.65 V to 1.95 V)
JESD8-5 (2.3 V to 2.7 V)
JESD8-B/JESD36 (2.7 V to 3.6 V)
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
Specified from -40 °C to +85 °C and -40 °C to +125 °C.
Parametrics
| Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|---|---|
| 74LVC1G32GM | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 2.1 | 150 | 1 | low | -40~125 | XSON6 |
| 74LVC1G32GN | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 2.1 | 150 | 1 | low | -40~125 | XSON6 |
| 74LVC1G32GS | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 2.1 | 150 | 1 | low | -40~125 | XSON6 |
| 74LVC1G32GV | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 2.1 | 150 | 1 | low | -40~125 | TSOP5 |
| 74LVC1G32GW | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 2.1 | 150 | 1 | low | -40~125 | TSSOP5 |
| 74LVC1G32GX | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 2.1 | 150 | 1 | low | -40~125 | X2SON5 |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74LVC1G32GM | 74LVC1G32GM,115 (935277189115) |
Active | VG |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_115 |
| 74LVC1G32GM,132 (935277189132) |
Active | VG | SOT886_132 | ||||
| 74LVC1G32GN | 74LVC1G32GN,132 (935288985132) |
Active | VG |
XSON6 (SOT1115) |
SOT1115 |
REFLOW_BG-BD-1
|
SOT1115_132 |
| 74LVC1G32GS | 74LVC1G32GS,132 (935292909132) |
Active | VG |
XSON6 (SOT1202) |
SOT1202 |
REFLOW_BG-BD-1
|
SOT1202_132 |
| 74LVC1G32GV | 74LVC1G32GV,125 (935272013125) |
Active | V32 |
TSOP5 (SOT753) |
SOT753 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT753_125 |
| 74LVC1G32GW | 74LVC1G32GW,125 (935268381125) |
Active | VG |
TSSOP5 (SOT353-1) |
SOT353-1 |
WAVE_BG-BD-1
|
SOT353-1_125 |
| 74LVC1G32GX | 74LVC1G32GX,125 (935298226125) |
Active | VG |
X2SON5 (SOT1226-3) |
SOT1226-3 | SOT1226-3_125 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74LVC1G32GM | 74LVC1G32GM,115 | 74LVC1G32GM |
|
|
| 74LVC1G32GM | 74LVC1G32GM,132 | 74LVC1G32GM |
|
|
| 74LVC1G32GN | 74LVC1G32GN,132 | 74LVC1G32GN |
|
|
| 74LVC1G32GS | 74LVC1G32GS,132 | 74LVC1G32GS |
|
|
| 74LVC1G32GV | 74LVC1G32GV,125 | 74LVC1G32GV |
|
|
| 74LVC1G32GW | 74LVC1G32GW,125 | 74LVC1G32GW |
|
|
| 74LVC1G32GX | 74LVC1G32GX,125 | 74LVC1G32GX |
|
|
Documentation (32)
| File name | Title | Type | Date |
|---|---|---|---|
| 74LVC1G32 | Single 2-input OR gate | Data sheet | 2024-07-15 |
| AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
| AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
| mna164 | Block diagram: 74LVC1G32GF, 74LVC1G32GM, 74LVC1G32GV, 74LVC1G32GW | Block diagram | 2009-11-04 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT1115 | 3D model for products with SOT1115 package | Design support | 2023-02-02 |
| SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
| SOT753 | 3D model for products with SOT753 package | Design support | 2019-01-22 |
| SOT353-1 | 3D model for products with SOT353-1 package | Design support | 2019-09-23 |
| SOT1226-3 | 3D model for products with SOT1226-3 package | Design support | 2021-01-28 |
| lvc1g32 | 74LVC1G32 IBIS model | IBIS model | 2014-10-20 |
| Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT1115_mk | plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Marcom graphics | 2017-01-28 |
| TSSOP5_SOT353-1_mk | plastic, thin shrink small outline package; 5 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body | Marcom graphics | 2018-07-25 |
| SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
| SOT1115 | plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Package information | 2022-05-27 |
| SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
| SOT753 | plastic, surface-mounted package; 5 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body | Package information | 2022-05-31 |
| SOT353-1 | plastic thin shrink small outline package; 5 leads; body width 1.25 mm | Package information | 2022-11-15 |
| SOT1226-3 | plastic thermal enhanced extremely thin small outline package; no leads;5 terminals; body 0.8 x 0.8 x 0.32 mm | Package information | 2020-08-27 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
| MAR_SOT1115 | MAR_SOT1115 Topmark | Top marking | 2013-06-03 |
| MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
| MAR_SOT753 | MAR_SOT753 Topmark | Top marking | 2013-06-03 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
Support
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Models
| File name | Title | Type | Date |
|---|---|---|---|
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT1115 | 3D model for products with SOT1115 package | Design support | 2023-02-02 |
| SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
| SOT753 | 3D model for products with SOT753 package | Design support | 2019-01-22 |
| SOT353-1 | 3D model for products with SOT353-1 package | Design support | 2019-09-23 |
| SOT1226-3 | 3D model for products with SOT1226-3 package | Design support | 2021-01-28 |
| lvc1g32 | 74LVC1G32 IBIS model | IBIS model | 2014-10-20 |
Ordering, pricing & availability
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