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Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

74AVC1T1022

1-to-4 fan-out buffer

The 74AVC1T1022 is a translating 1-to-4 fan-out buffer suitable for use in clock distribution. It has dual supplies (VCC(A) and VCC(B)) for voltage translation. It also has a data input (A), four data outputs (1Yn and 2Yn) and an output enable input (OE). VCC(A) and VCC(B) can be independently supplied at any voltage between 0.8 V and 3.6 V. It makes the device suitable for low voltage translation between any of the following voltages: 0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V and 3.3 V. The levels of A, OE and 1Yn are referenced to VCC(A), outputs 2Yn are referenced to VCC(B). This supply configuration ensures that two of the fanned out signals can be used in level shifting. A HIGH on OE causes all outputs to be pulled LOW via pull-down resistors, a LOW on OE disconnects the pull-down resistors and enables all outputs.

Schmitt trigger action at all inputs makes the circuit tolerant for slower input rise and fall time.

The IOFF circuitry disables the output, preventing any damaging backflow current through the device when it is powered down.

Features and benefits

  • Wide supply voltage range:

    • VCC(A): 0.8 V to 3.6 V

    • VCC(B): 0.8 V to 3.6 V

  • Complies with JEDEC standards:

    • JESD8-12 (0.8 V to 1.3 V)

    • JESD8-11 (0.9 V to 1.65 V)

    • JESD8-7 (1.2 V to 1.95 V)

    • JESD8-5 (1.8 V to 2.7 V)

    • JESD8-B (2.7 V to 3.6 V)

  • Maximum data rates:

    • 380 Mbit/s (≥ 1.8 V to 3.3 V translation)

    • 200 Mbit/s (≥ 1.1 V to 3.3 V translation)

    • 200 Mbit/s (≥ 1.1 V to 2.5 V translation)

    • 200 Mbit/s (≥ 1.1 V to 1.8 V translation)

    • 150 Mbit/s (≥ 1.1 V to 1.5 V translation)

    • 100 Mbit/s (≥ 1.1 V to 1.2 V translation)

  • Latch-up performance exceeds 100 mA per JESD 78 Class II

  • Inputs accept voltages up to 3.6 V

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3B exceeds 8000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

Parametrics

Type number VCC(A) (V) VCC(B) (V) Logic switching levels Output drive capability (mA) tpd (ns) Nr of bits Power dissipation considerations Tamb (°C) Package name
74AVC1T1022DP 0.8 - 3.6 0.8 - 3.6 CMOS/LVTTL ± 12 4.0 1 very low -40~125 TSSOP10
74AVC1T1022GU 0.8 - 3.6 0.8 - 3.6 CMOS/LVTTL ± 12 4.0 1 very low -40~125 XQFN10

Package

Type number Orderable part number, (Ordering code (12NC)) Status Marking Package Package information Reflow-/Wave soldering Packing
74AVC1T1022DP 74AVC1T1022DPJ
(935305831118)		 Active B2 SOT552-1
TSSOP10
(SOT552-1) 		SOT552-1 SSOP-TSSOP-VSO-WAVE
SOT552-1_118
74AVC1T1022GU 74AVC1T1022GUX
(935305832115)		 Active B2 SOT1160-1
XQFN10
(SOT1160-1) 		SOT1160-1 SOT1160-1_115

Environmental information

Type number Orderable part number Chemical content RoHS RHF-indicator
74AVC1T1022DP 74AVC1T1022DPJ 74AVC1T1022DP rohs rhf rhf
74AVC1T1022GU 74AVC1T1022GUX 74AVC1T1022GU rohs rhf rhf
Quality and reliability disclaimer

Documentation (14)

File name Title Type Date
74AVC1T1022 1-to-4 fan-out buffer Data sheet 2024-06-25
Nexperia_document_guide_Logic_translators Nexperia Logic Translators Brochure 2021-04-12
Nexperia_document_guide_MiniLogic_PicoGate_201901 PicoGate leaded logic portfolio guide Brochure 2019-01-07
Nexperia_document_guide_MiniLogic_MicroPak_201808 MicroPak leadless logic portfolio guide Brochure 2018-09-03
SOT552-1 3D model for products with SOT552-1 package Design support 2020-01-22
SOT1160-1 3D model for products with SOT1160-1 package Design support 2019-10-03
avc1t1022 74AVC1T1022 IBIS model IBIS model 2015-10-26
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
TSSOP10_SOT552_mk plastic, thin shrink small outline package; 10 leads; 0.5 mm pitch; 3 mm x 3 mm x 1.1 mm body Marcom graphics 2017-01-28
XQFN10_SOT1160-1_mk plastic, extremely thin quad flat package; no leads; 10 terminals; 0.4 mm pitch; 1.4 mm x 1.8 mm x 0.5 mm body Marcom graphics 2017-01-28
SOT552-1 plastic, thin shrink small outline package; 10 leads; 0.5 mm pitch; 3 mm x 3 mm x 1.1 mm body Package information 2022-06-07
SOT1160-1 plastic, leadless extremely thin quad flat package; 10 terminals; 0.4 mm pitch; 1.4 mm x 1.8 mm x 0.5 mm body Package information 2022-06-07
Nexperia_Selection_guide_2023 Nexperia Selection Guide 2023 Selection guide 2023-05-10
SSOP-TSSOP-VSO-WAVE Footprint for wave soldering Wave soldering 2009-10-08

Support

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Models

File name Title Type Date
SOT552-1 3D model for products with SOT552-1 package Design support 2020-01-22
SOT1160-1 3D model for products with SOT1160-1 package Design support 2019-10-03
avc1t1022 74AVC1T1022 IBIS model IBIS model 2015-10-26

Ordering, pricing & availability

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