74AXP1T32
Dual supply 2-input OR gate
The 74AXP1T32 is a dual supply 2-input OR gate. It features two inputs (A, B), an output (Y) and dual supply pins (VCCI and VCCO). The inputs are referenced to VCCI and the output is referenced to VCCO. All inputs can be connected directly to VCCI or GND. VCCI can be supplied at any voltage between 0.7 V and 2.75 V. VCCO can be supplied at any voltage between 1.2 V and 5.5 V. This feature allows voltage level translation.
Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times.
This device ensures very low static and dynamic power consumption across the entire supply range and is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.
Features and benefits
Wide supply voltage range:
VCCI: 0.7 V to 2.75 V
VCCO: 1.2 V to 5.5 V
Low input capacitance; CI = 0.6 pF (typical)
Low output capacitance; CO = 1.8 pF (typical)
Low dynamic power consumption; CPD = 0.5 pF at VCCI = 1.2 V (typical)
Low dynamic power consumption; CPD = 7.1 pF at VCCO = 3.3 V (typical)
Low static power consumption; ICCI = 0.5 μA (85 °C maximum)
Low static power consumption; ICCO = 1.8 μA (85 °C maximum)
High noise immunity
Complies with JEDEC standard:
JESD8-12A.01 (1.1 V to 1.3 V; A, B input)
JESD8-11A.01 (1.4 V to 1.6 V)
JESD8-7A (1.65 V to 1.95 V)
JESD8-5A.01 (2.3 V to 2.7 V)
JESD8-C (2.7 V to 3.6 V; Y output)
JESD12-6 (4.5 V to 5.5 V; Y output)
ESD protection:
HBM ANSI/ESDA/JEDEC JS-001 Class 2 exceeds 2 kV
CDM JESD22-C101E exceeds 1000 V
Latch-up performance exceeds 100 mA per JESD78D Class II
Inputs accept voltages up to 2.75 V
Low noise overshoot and undershoot < 10 % of VCCO
IOFF circuitry provides partial power-down mode operation
Multiple package options
Specified from -40 °C to +85 °C
Parametrics
| Type number |
|---|
Package
All type numbers in the table below are discontinued.
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74AXP1T32GM | 74AXP1T32GMX (935691217115) |
Obsolete | no package information | ||||
| 74AXP1T32GS | 74AXP1T32GSH (935691220125) |
Withdrawn / End-of-life | rT |
XSON6 (SOT1202) |
SOT1202 |
REFLOW_BG-BD-1
|
Not available |
| 74AXP1T32GX | 74AXP1T32GXZ (935308977147) |
Withdrawn / End-of-life | rT |
X2SON6 (SOT1255-2) |
SOT1255-2 | SOT1255-2_147 | |
Environmental information
All type numbers in the table below are discontinued.
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74AXP1T32GM | 74AXP1T32GMX | 74AXP1T32GM |
|
|
| 74AXP1T32GS | 74AXP1T32GSH | 74AXP1T32GS |
|
|
| 74AXP1T32GX | 74AXP1T32GXZ | 74AXP1T32GX |
|
|
Documentation (15)
| File name | Title | Type | Date |
|---|---|---|---|
| 74AXP1T32 | Dual supply 2-input OR gate | Data sheet | 2022-02-28 |
| AN90029 | Pin FMEA for AXPnT family | Application note | 2021-07-13 |
| Nexperia_document_guide_Logic_translators | Nexperia Logic Translators | Brochure | 2021-04-12 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
| SOT1255-2 | 3D model for products with SOT1255-2 package | Design support | 2021-01-28 |
| axp1t32 | 74AXP1T32 IBIS Model | IBIS model | 2016-12-12 |
| Nexperia_document_leaflet_Logic_AXP_technology_portfolio_201904 | AXP – Extremely low-power logic technology portfolio | Leaflet | 2019-04-05 |
| Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
| SOT1255-2 | plastic thermal enhanced extremely thin small outline package; no leads;6 terminals; body 1.0 x 0.8 x 0.32 mm | Package information | 2020-08-27 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
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