PCMFxUSB3S
Common-mode EMI filter for differential channels with integrated ESD protection
Common-mode ElectroMagnetic Interference (EMI) filters with integrated ElectroStatic Discharge (ESD) protection for one, two and three differential channels. The devices are designed to provide low insertion loss for differential high-speed signals on each channel while unwanted common-mode signals are attenuated.
Each differential channel incorporates two signal lines that are coupled by integrated coils. Diodes provide protection to downstream components from ESD voltages up to ±15 kV on each signal line.
Type number | Number of channels | Package Name |
---|---|---|
PCMF1USB3S | 1 | WLCSP5 |
PCMF2USB3S | 2 | WLCSP10 |
PCMF3USB3S | 3 | WLCSP15 |
Features and benefits
One, two and three differential channels common-mode EMI filter with integrated ESD protection
Superior common-mode suppression over a wide frequency range
Extremely high symmetry between line pairs
ESD protection up to ±15 kV contact discharge according to IEC 61000-4-2
Superior RF performance compared to other integrated filters or discrete filters with external ESD protection
Industry-standard WLCSP5, 10 and 15 packages for smallest footprint
Applications
Smartphone, cellular and cordless phone
USB3.2, USB2.0, HDMI2.0, HDMI1.4
General-purpose EMI and Radio-Frequency Interference (RFI) filter and downstream ESD protection
Tablet PC and Mobile Internet Device (MID)
MIPI D-PHY as used in Camera Serial Interface (CSI) and Display Serial Interface (DSI)
Parametrics
Type number | Package version | Package name | Size (mm) | Configuration | Nr of lines | VRWM (V) (V) | Cd [typ] (pF) | IPPM [max] (A) | VESD (kV) (kV) |
---|---|---|---|---|---|---|---|---|---|
PCMF1USB3S | WLCSP5_2-1-2 | WLCSP5 | 0.77 x 1.17 x 0.57 | Unidirectional | 2 | 5 | 0.25 | 7 | 15 |
PCMF2USB3S | WLCSP10_4-2-4 | WLCSP10 | 1.57 x 1.17 x 0.57 | Unidirectional | 4 | 5 | 0.25 | 7 | 15 |
PCMF3USB3S | WLCSP15_6-3-6 | WLCSP15 | 2.37 x 1.17 x 0.57 | Unidirectional | 6 | 5 | 0.3 | 7 | 15 |
Package
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
PCMF1USB3S | PCMF1USB3S/CZ (934071027087) |
Active |
WLCSP5 (WLCSP5_2-1-2) |
WLCSP5_2-1-2 | Not available | ||
PCMF1USB3SZ (934069594087) |
Active | P "with circle" | Not available | ||||
PCMF2USB3S | PCMF2USB3S/CZ (934071028087) |
Active |
WLCSP10 (WLCSP10_4-2-4) |
WLCSP10_4-2-4 | WLCSP10_PCMF_PESD2USB3X_PCMF2HDMI2X_087 | ||
PCMF2USB3SZ (934069591087) |
Active | P with circle | WLCSP10_PCMF_PESD2USB3X_PCMF2HDMI2X_087 | ||||
PCMF3USB3S | PCMF3USB3S/CZ (934071026087) |
Active |
WLCSP15 (WLCSP15_6-3-6) |
WLCSP15_6-3-6 | WLCSP15_PCMF_PESD3USB3X_PCMF3HDMI2X_087 | ||
PCMF3USB3SZ (934069589087) |
Active | P with circle | WLCSP15_PCMF_PESD3USB3X_PCMF3HDMI2X_087 |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
PCMF1USB3S | PCMF1USB3S/CZ | PCMF1USB3S | ||
PCMF1USB3S | PCMF1USB3SZ | PCMF1USB3S | ||
PCMF2USB3S | PCMF2USB3S/CZ | PCMF2USB3S | ||
PCMF2USB3S | PCMF2USB3SZ | PCMF2USB3S | ||
PCMF3USB3S | PCMF3USB3S/CZ | PCMF3USB3S | ||
PCMF3USB3S | PCMF3USB3SZ | PCMF3USB3S |
Documentation (10)
File name | Title | Type | Date |
---|---|---|---|
PCMFXUSB3S_SER | Common-mode EMI filter for differential channels with integrated ESD protection | Data sheet | 2019-03-07 |
WLCSP5_2-1-2 | 3D model for products with WLCSP5_2-1-2 package | Design support | 2023-03-13 |
WLCSP10_4-2-4 | 3D model for products with WLCSP10_4-2-4 package | Design support | 2023-03-13 |
WLCSP15_6-3-6 | 3D model for products with WLCSP15_6-3-6 package | Design support | 2023-03-13 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
WLCSP5_2-1-2_mk | wafer level chip-size package; 5 bumps (2-1-2) | Marcom graphics | 2017-01-28 |
WLCSP10_4-2-4_mk | wafer level chip-size package; 10 bumps (4-2-4) | Marcom graphics | 2017-01-28 |
WLCSP5_2-1-2 | wafer level chip-size package; 5 bumps (2-1-2); 0.4 mm pitch; 0.77 x 1.17 x 0.57 mm body | Package information | 2020-04-21 |
WLCSP10_4-2-4 | wafer level chip-size package; 10 bumps (4-2-4); 0.4 mm pitch; 1.57 x 1.17 x 0.57 mm body | Package information | 2020-04-21 |
WLCSP15_6-3-6 | wafer level chip-size package; 15 bumps (6-3-6); 0.4 mm pitch; 2.37 x 1.17 x 0.57 mm body | Package information | 2020-04-21 |
Support
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Models
File name | Title | Type | Date |
---|---|---|---|
WLCSP5_2-1-2 | 3D model for products with WLCSP5_2-1-2 package | Design support | 2023-03-13 |
WLCSP10_4-2-4 | 3D model for products with WLCSP10_4-2-4 package | Design support | 2023-03-13 |
WLCSP15_6-3-6 | 3D model for products with WLCSP15_6-3-6 package | Design support | 2023-03-13 |
Ordering, pricing & availability
Sample
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If you do not have a direct account with Nexperia our network of global and regional distributors is available and equipped to support you with Nexperia samples. Check out the list of official distributors.