Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 1PS66SB17

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
1PS66SB17SOT666SOT62.136597 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93405874311514126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.060000100.0000002.808204
subTotal0.060000100.0000002.808204
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0008000.0800000.037443
Carbon (C)7440-44-00.0004000.0400000.018721
Chromium (Cr)7440-47-30.0021000.2100000.098287
Cobalt (Co)7440-48-40.0042000.4200000.196574
Iron (Fe)7439-89-60.46860046.86000021.932072
Manganese (Mn)7439-96-50.0084000.8400000.393149
Nickel (Ni)7440-02-00.35290035.29000016.516919
Phosphorus (P)7723-14-00.0002000.0200000.009361
Silicon (Si)7440-21-30.0025000.2500000.117008
Sulphur (S)7704-34-90.0002000.0200000.009361
Pure metal layerCopper (Cu)7440-50-80.12960012.9600006.065720
Silver (Ag)7440-22-40.0301003.0100001.408782
subTotal1.000000100.00000046.803398
Mould CompoundFillerSilica fused60676-86-00.71000071.00000033.230413
PigmentCarbon black1333-86-40.0030000.3000000.140410
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.19700019.7000009.220269
Phenolic resinProprietary0.0900009.0000004.212306
subTotal1.000000100.00000046.803398
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000020.0030000.000089
Bismuth (Bi)7440-69-90.0000010.0010000.000030
Copper (Cu)7440-50-80.0000010.0010000.000030
Lead (Pb)7439-92-10.0000030.0050000.000149
Tin solderTin (Sn)7440-31-50.06372099.9900002.982295
subTotal0.063726100.0000002.982593
WireImpurityNon hazardousProprietary0.0000010.0100000.000060
Pure metalGold (Au)7440-57-50.01287099.9900000.602346
subTotal0.012871100.0000000.602407
total2.136597100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.