Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 2N7002BKMB

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
2N7002BKMBSOT883BXQFN30.69995 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340658623159126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0022876.000000.32574
PolymerBisphenol-F/Formaldehyde/Epichlorohydrin copolymer9003-36-50.0003110.470000.04487
Phenolic resinProprietary0.0004113.530000.05799
subTotal0.00300100.000000.42860
DieDoped siliconSilicon (Si)7440-21-30.05000100.000007.14337
subTotal0.05000100.000007.14337
Lead FrameCopper alloyChromium (Cr)7440-47-30.000670.240000.09601
Copper (Cu)7440-50-80.2632094.0000037.60269
Tin (Sn)7440-31-50.000670.240000.09601
Zinc (Zn)7440-66-60.000590.210000.08401
Pure metal layerGold (Au)7440-57-50.000220.080000.03200
Nickel (Ni) - cas no. 7440-02-07440-02-00.013834.940001.97614
Palladium (Pd)7440-05-30.000810.290000.11601
subTotal0.28000100.0000040.00287
Mould CompoundFillerSilica -amorphous-7631-86-90.0680020.000009.71498
Silica fused60676-86-00.2193064.5000031.33081
Flame retardantMetal hydroxideProprietary0.010203.000001.45725
ImpuritySilicon Dioxide (SiO2)14808-60-70.001700.500000.24287
PigmentCarbon black1333-86-40.001020.300000.14572
PolymerPhenol Formaldehyde resin (generic)9003-35-40.007482.200001.06865
Phenolic resinProprietary0.008502.500001.21437
Tetramethylbiphenyl diglycidyl ether85954-11-60.023807.000003.40024
subTotal0.34000100.0000048.57489
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.010000.00029
Bismuth (Bi)7440-69-90.000000.020000.00057
Iron (Fe)7439-89-60.000000.010000.00029
Lead (Pb)7439-92-10.000000.010000.00029
Tin solderTin (Sn)7440-31-50.0199999.950002.85592
subTotal0.02000100.000002.85736
WireImpurityNon hazardousProprietary0.000000.010000.00010
Pure metalGold (Au)7440-57-50.0069599.990000.99340
subTotal0.00695100.000000.99350
total0.69995100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.