Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74ABT125BQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74ABT125BQSOT762-1DHVQFN1418.006163 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93528559811514126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0002331.0000000.001292
FillerSilver (Ag)7440-22-40.01744575.0000000.096883
PolymerAcrylic resinProprietary0.0013966.0000000.007751
Resin systemProprietary0.00418718.0000000.023252
subTotal0.023260100.0000000.129178
DieDoped siliconSilicon (Si)7440-21-30.244650100.0000001.358701
subTotal0.244650100.0000001.358701
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.80297297.47000037.781354
Iron (Fe)7439-89-60.1675092.4000000.930289
Phosphorus (P)7723-14-00.0020940.0300000.011629
Zinc (Zn)7440-66-60.0069800.1000000.038762
subTotal6.979555100.00000038.762034
Mould CompoundAdditiveNon hazardousProprietary0.3139172.9840001.743385
FillerSilica -amorphous-7631-86-90.3671483.4900002.039013
Silica fused60676-86-08.92306484.82000049.555610
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1054101.0020000.585413
PigmentCarbon black1333-86-40.0172530.1640000.095816
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.3893453.7010002.162289
Epoxy resin systemProprietary0.1668471.5860000.926612
Phenolic resinProprietary0.2370162.2530001.316303
subTotal10.520000100.00000058.424441
Pre-PlatingPure metal layerGold (Au)7440-57-50.0017721.0000000.009840
Nickel (Ni)7440-02-00.16123091.0000000.895417
Palladium (Pd)7440-05-30.0141748.0000000.078718
subTotal0.177176100.0000000.983974
WirePure metalCopper (Cu)7440-50-80.05939996.5500000.329882
Pure metal layerGold (Au)7440-57-50.0002150.3500000.001196
Palladium (Pd)7440-05-30.0019073.1000000.010592
subTotal0.061522100.0000000.341670
total18.006163100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.