Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74AHC157BQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AHC157BQ-Q100SOT763-1DHVQFN1621.680405 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9353006851155126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0009971.0000000.004598
FillerSilver (Ag)7440-22-40.07476075.0000000.344828
PolymerAcrylic resinProprietary0.0059816.0000000.027586
Resin systemProprietary0.01794218.0000000.082759
subTotal0.099680100.0000000.459770
DieDoped siliconSilicon (Si)7440-21-30.356210100.0000001.643006
subTotal0.356210100.0000001.643006
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-87.97467497.47000036.782863
Iron (Fe)7439-89-60.1963602.4000000.905703
Phosphorus (P)7723-14-00.0024550.0300000.011321
Zinc (Zn)7440-66-60.0081820.1000000.037738
subTotal8.181670100.00000037.737625
Mould CompoundAdditiveNon hazardousProprietary0.3711642.9840001.711979
FillerSilica -amorphous-7631-86-90.4341033.4900002.002281
Silica fused60676-86-010.55031084.82000048.662884
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1246331.0020000.574867
PigmentCarbon black1333-86-40.0203990.1640000.094090
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.4603483.7010002.123336
Epoxy resin systemProprietary0.1972741.5860000.909919
Phenolic resinProprietary0.2802392.2530001.292590
subTotal12.438470100.00000057.371945
Pre-PlatingPure metal layerGold (Au)7440-57-50.0163653.0000000.075484
Nickel (Ni)7440-02-00.50350692.3000002.322400
Palladium (Pd)7440-05-30.0169113.1000000.078000
Silver (Ag)7440-22-40.0087281.6000000.040258
subTotal0.545510100.0000002.516143
WirePure metalCopper (Cu)7440-50-80.05683496.5500000.262143
Pure metal layerGold (Au)7440-57-50.0002060.3500000.000950
Palladium (Pd)7440-05-30.0018253.1000000.008417
subTotal0.058864100.0000000.271510
total21.680405100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.