Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74AHC573BQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AHC573BQSOT764-1DHVQFN2027.919932 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93528055511511126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0008531.0000000.003054
FillerSilver (Ag)7440-22-40.06396075.0000000.229084
PolymerAcrylic resinProprietary0.0051176.0000000.018327
Resin systemProprietary0.01535018.0000000.054980
subTotal0.085280100.0000000.305445
DieDoped siliconSilicon (Si)7440-21-30.229532100.0000000.822108
subTotal0.229532100.0000000.822108
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.58916097.47000037.926884
Iron (Fe)7439-89-60.2607362.4000000.933872
Phosphorus (P)7723-14-00.0032590.0300000.011673
Zinc (Zn)7440-66-60.0108640.1000000.038911
subTotal10.864020100.00000038.911341
Mould CompoundAdditiveNon hazardousProprietary0.4886272.9840001.750102
FillerSilica -amorphous-7631-86-90.5714843.4900002.046869
Silica fused60676-86-013.88919984.82000049.746535
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1640771.0020000.587668
PigmentCarbon black1333-86-40.0268550.1640000.096185
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.6060353.7010002.170619
Epoxy resin systemProprietary0.2597061.5860000.930182
Phenolic resinProprietary0.3689272.2530001.321374
subTotal16.374910100.00000058.649534
Pre-PlatingPure metal layerGold (Au)7440-57-50.0027581.0000000.009877
Nickel (Ni)7440-02-00.25095191.0000000.898823
Palladium (Pd)7440-05-30.0220628.0000000.079017
subTotal0.275770100.0000000.987717
WirePure metalCopper (Cu)7440-50-80.08730196.5500000.312683
Pure metal layerGold (Au)7440-57-50.0003160.3500000.001133
Palladium (Pd)7440-05-30.0028033.1000000.010040
subTotal0.090420100.0000000.323856
total27.919932100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.