Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74AHCT04BQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AHCT04BQ-Q100SOT762-1DHVQFN1418.187504 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9353013781155126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0002331.0000000.001279
FillerSilver (Ag)7440-22-40.01744575.0000000.095918
PolymerAcrylic resinProprietary0.0013966.0000000.007673
Resin systemProprietary0.00418718.0000000.023020
subTotal0.023260100.0000000.127890
DieDoped siliconSilicon (Si)7440-21-30.212030100.0000001.165800
subTotal0.212030100.0000001.165800
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.74471097.47000037.084306
Iron (Fe)7439-89-60.1660752.4000000.913125
Phosphorus (P)7723-14-00.0020760.0300000.011414
Zinc (Zn)7440-66-60.0069200.1000000.038047
subTotal6.919780100.00000038.046892
Mould CompoundAdditiveNon hazardousProprietary0.3139172.9840001.726004
FillerSilica -amorphous-7631-86-90.3671483.4900002.018685
Silica fused60676-86-08.92307284.82000049.061556
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1054111.0020000.579577
PigmentCarbon black1333-86-40.0172530.1640000.094861
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.3893463.7010002.140731
Epoxy resin systemProprietary0.1668471.5860000.917374
Phenolic resinProprietary0.2370162.2530001.303180
subTotal10.520010100.00000057.841967
Pre-PlatingPure metal layerGold (Au)7440-57-50.0138423.0000000.076107
Nickel (Ni)7440-02-00.42587292.3000002.341565
Palladium (Pd)7440-05-30.0143033.1000000.078644
Silver (Ag)7440-22-40.0073821.6000000.040591
subTotal0.461400100.0000002.536907
WirePure metalCopper (Cu)7440-50-80.04926496.5500000.270868
Pure metal layerGold (Au)7440-57-50.0001790.3500000.000982
Palladium (Pd)7440-05-30.0015823.1000000.008697
subTotal0.051024100.0000000.280546
total18.187504100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.